Process of making hollow polyamide filaments
    2.
    发明授权
    Process of making hollow polyamide filaments 失效
    制造中空聚酰胺丝的工艺

    公开(公告)号:US5318738A

    公开(公告)日:1994-06-07

    申请号:US45295

    申请日:1993-04-13

    摘要: An improved process for preparing polyamide hollow filaments wherein an N,N'-dialkyl polycarbonamide is melt blended with the molten fiber-forming polyamide prior to spinning into filaments. The polycarbonamide substantially decreases the collapsing of the voids which naturally occurs immediately after spinning and before the filaments are completely cool.

    摘要翻译: 一种制备聚酰胺中空丝的改进方法,其中N,N'-二烷基聚碳酰胺在纺丝成长丝之前与形成熔融的纤维的聚酰胺熔融共混。 聚碳酰胺基本上减少了在纺丝之后和丝完全冷却之前自然发生的空隙的塌陷。

    Polyamide hollow filaments
    3.
    发明授权
    Polyamide hollow filaments 失效
    聚酰胺中空丝

    公开(公告)号:US5370935A

    公开(公告)日:1994-12-06

    申请号:US208911

    申请日:1994-03-11

    摘要: An improved process for preparing polyamide hollow filaments wherein an N,N'-dialkyl polycarbonamide is melt blended with the molten fiber-forming polyamide prior to spinning into filaments. The polycarbonamide substantially decreases the collapsing of the voids which naturally occurs immediately .after spinning and before the filaments are completely cool.

    摘要翻译: 一种制备聚酰胺中空丝的改进方法,其中N,N'-二烷基聚碳酰胺在纺丝成长丝之前与形成熔融的纤维的聚酰胺熔融共混。 聚碳酰胺基本上减少了自然发生的空隙的塌陷,在旋转之后以及丝完全冷却之前。

    Polyamide pigment dispersion
    4.
    发明授权
    Polyamide pigment dispersion 失效
    聚酰胺颜料分散体

    公开(公告)号:US5459195A

    公开(公告)日:1995-10-17

    申请号:US299381

    申请日:1994-09-01

    申请人: Raymond Longhi

    发明人: Raymond Longhi

    CPC分类号: D01F6/80 D01F1/04

    摘要: An improved process for preparing pigmented drawn polyamide fibers is disclosed, the improvement being the improved processability obtained from the use of an N,N'-dialkyl polycarbonamide as a carrier polymer for the pigment dispersion.

    摘要翻译: 公开了一种制备着色拉伸聚酰胺纤维的改进方法,其改进是使用N,N'-二烷基聚碳酰胺作为颜料分散体的载体聚合物获得的改进的加工性。

    Power short circuit testing of an electronics assembly employing pre-characterized power off resistance of an electronic component thereof from a power boundary
    5.
    发明申请
    Power short circuit testing of an electronics assembly employing pre-characterized power off resistance of an electronic component thereof from a power boundary 失效
    电子组件的电力短路测试,其采用电力边界的电子部件的预定义的断电电阻

    公开(公告)号:US20060271326A1

    公开(公告)日:2006-11-30

    申请号:US11137878

    申请日:2005-05-26

    IPC分类号: G01R31/14

    CPC分类号: G01R31/025

    摘要: A technique for testing an electronics assembly for a power short circuit is provided. The technique includes pre-characterizing power off resistance of an electronic component(s) of a first packaging level from at least one power boundary of the electronic component(s). The characterizing of the power off resistance occurs prior to placement of the electronic component(s) into an electronics assembly of a higher packaging level. The technique further includes determining actual power off resistance of the electronics component(s) after placement thereof into the electronics assembly, with the actual power off resistance being determined from the at least one power boundary. Thereafter, the actual power off resistance of the electronic component(s) in the electronics assembly is compared with the pre-characterized power off resistance of the at least one electronic component(s), and a determination is made therefrom whether a power short circuit exists within the electronics assembly.

    摘要翻译: 提供了一种用于测试用于电源短路的电子组件的技术。 该技术包括从电子部件的至少一个电源边界预先表征第一封装级别的电子部件的断电电阻。 在将电子部件放置到更高封装水平的电子组件之前,断电阻力的表征发生。 该技术还包括在将电子元件放入电子组件之后确定电子元件的实际断电电阻,其中实际断电电阻是从至少一个电源边界确定的。 此后,将电子组件中的电子部件的实际断电电阻与至少一个电子部件的预表示的断电电阻进行比较,并且确定电力短路 存在于电子组件内。

    Component indicators used during extended power-off service
    7.
    发明申请
    Component indicators used during extended power-off service 失效
    在延长关机服务期间使用的组件指示器

    公开(公告)号:US20070220324A1

    公开(公告)日:2007-09-20

    申请号:US11357147

    申请日:2006-02-17

    IPC分类号: G06F11/00

    CPC分类号: G06F1/263 G06F1/30 G06F11/325

    摘要: A method and related apparatus for servicing an electrical/electronic device during power shut offs is provided. The apparatus comprises a service logic having a memory and control component for storing device information during normal device operation and one or more indicators driven by the memory and control component after power shut off to provide service signals. The service logic also includes an auxiliary energy source selectively engageable to provide auxiliary power to the memory and control component during power shut off and to enable providing of service signals through the indicator(s).

    摘要翻译: 提供了一种用于在电源关闭期间维护电气/电子设备的方法和相关装置。 该装置包括具有用于在正常设备操作期间存储设备信息的存储器和控制组件的服务逻辑以及在电源关闭之后由存储器和控制组件驱动以提供服务信号的一个或多个指示器。 服务逻辑还包括辅助能量源,其选择性地可接合以在电源切断期间向存储器和控制部件提供辅助电力,并且能够通过指示器提供服务信号。

    Device for sensing temperature of an electronic chip
    8.
    发明授权
    Device for sensing temperature of an electronic chip 失效
    用于感测电子芯片温度的装置

    公开(公告)号:US06786639B2

    公开(公告)日:2004-09-07

    申请号:US10232258

    申请日:2002-08-30

    IPC分类号: G01K1500

    CPC分类号: G01K7/00

    摘要: A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.

    摘要翻译: 一种用于测量电子芯片上的温度的方法和装置。 该装置包括芯片上的热感测元件,在已知电压和温度下使电流通过所述热感测元件的电源,以及确定热感测元件在所述已知电压和温度下的初始电阻的测量电路。 随着电子芯片的温度变化,测量电路测量热敏元件的电阻变化,并将热敏元件的电阻变化与初始电阻进行比较。 测量电路在电子芯片的操作期间从初始电阻和热感测元件的电阻变化确定电子芯片的温度。