-
公开(公告)号：US11325414B2
公开(公告)日：2022-05-10
申请号：US17288857
申请日：2019-08-28
Applicant: Nissha Co., Ltd.
Inventor： Chuzo Taniguchi , Satoshi Wada , Michiyasu Okuda
Abstract: A transfer sheet is configured to include a base sheet; a releasable layer laminated on the base sheet, containing an ultraviolet curing resin, and including minute irregularities on at least part of a surface opposite to a surface in contact with the base sheet; a peeling layer laminated entirely on the releasable layer; and a single color solid print layer laminated in a section on the peeling layer corresponding at least to a region where the minute irregularities of the releasable layer are formed. A maximum width W of a recessed portion of the minute irregularities and a depth D of the recessed portion of the minute irregularities satisfy 10≤W/D≤50, W≤100 μm and 2 μm≤D≤10 μm. At least one of the number of recessed portions per unit area and the depth of the recessed portion changes stepwise.
-
公开(公告)号：US20210299933A1
公开(公告)日：2021-09-30
申请号：US17262678
申请日：2019-06-13
Applicant: Nissha Co., Ltd.
Inventor： Chuzo Taniguchi , Satoshi Wada
Abstract: A manufacturing method is configured to include arranging a conductive circuit-attached film, in which a conductive circuit having stretchability is formed on a base film, on a molding surface of a first mold having the molding surface for forming an internal surface of a preform; mold-clamping the first mold and a second mold paired with the first mold; molding the preform by injecting molten resin into a cavity formed by the mold-clamping; mold-opening the first mold and the second mold; taking out a conductive circuit-attached preform in which the conductive circuit-attached film and the preform are integrated; and blow-molding the conductive circuit-attached preform.
-
公开(公告)号：US20220001687A1
公开(公告)日：2022-01-06
申请号：US17288857
申请日：2019-08-28
Applicant: Nissha Co., Ltd.
Inventor： Chuzo Taniguchi , Satoshi Wada , Michiyasu Okuda
Abstract: A transfer sheet is configured to include a base sheet; a releasable layer laminated on the base sheet, containing an ultraviolet curing resin, and including minute irregularities on at least part of a surface opposite to a surface in contact with the base sheet; a peeling layer laminated entirely on the releasable layer; and a single color solid print layer laminated in a section on the peeling layer corresponding at least to a region where the minute irregularities of the releasable layer are formed. A maximum width W of a recessed portion of the minute irregularities and a depth D of the recessed portion of the minute irregularities satisfy 10≤W/D≤50, W≤100 μm and 2 μm≤D≤10 μm. At least one of the number of recessed portions per unit area and the depth of the recessed portion changes stepwise.
-
公开(公告)号：US11820065B2
公开(公告)日：2023-11-21
申请号：US17262678
申请日：2019-06-13
Applicant: Nissha Co., Ltd.
Inventor： Chuzo Taniguchi , Satoshi Wada
CPC classification number: B29C49/20 , B29B11/08 , B29C49/06 , B65D1/02 , B29C2049/2008 , B29C2049/2071
Abstract: A manufacturing method is configured to include arranging a conductive circuit-attached film, in which a conductive circuit having stretchability is formed on a base film, on a molding surface of a first mold having the molding surface for forming an internal surface of a preform; mold-clamping the first mold and a second mold paired with the first mold; molding the preform by injecting molten resin into a cavity formed by the mold-clamping; mold-opening the first mold and the second mold; taking out a conductive circuit-attached preform in which the conductive circuit-attached film and the preform are integrated; and blow-molding the conductive circuit-attached preform.
-
-
-
Search Results
4
records
(took 0.01 seconds)
