公开(公告)号：US5431579A

公开(公告)日：1995-07-11

申请号：US272840

申请日：1994-07-11

申请人： Nobuaki Kishi ,  Nobuhisa Arai ,  Masanori Takagishi ,  Hiroshi Henmi

发明人： Nobuaki Kishi ,  Nobuhisa Arai ,  Masanori Takagishi ,  Hiroshi Henmi

IPC分类号： H01L23/32 ,  G01R1/04 ,  H01R33/76 ,  H05K7/10 ,  H01R11/22

CPC分类号： G01R1/0433 ,  H05K7/1023

摘要： A receiving tray 6 is disposed on a pedestal surface 1a of a base member 1 vertically and movably, while below the pedestal surface 1a are disposed a push-up member 7 interlocked with the receiving tray and a spring 8 for urging the push-up member 7 downwards. A seating surface if for package leads P2 is formed along side portions of the pedestal surface 1a, and a large number of contacts 2 are arranged side by side, the contacts 2 having respective contact portions 2a for contact with the leads P2 which contact portions 2a are urged inwards to obtain a predetermined contact pressure for the leads. There are used movable cams 4 adapted to rotate upon depression of a cover 5 which covers the base member, to displace the contact portions 2a of the contacts 2 outwards away from the package leads P2. The movable cams 4 are each provided with an actuating arm 4c which comes into abutment with the push-up member 7 upon depression of the cover 5 and consequent rotation of the cam 4 to push up the receiving tray 6.

摘要翻译： 接收托盘6垂直且可移动地设置在基座构件1的基座面1a上，而基座面1a的下方配置有与接收托盘互锁的上推构件7和用于推压上推构件的弹簧8 7向下 如果沿着基座面1a的侧面形成包装引线P2的座面，并且大量的接点2并列配置，则接点2具有与接触部2a的引线P2接触的接触部2a 被向内推动以获得引线的预定接触压力。 使用可移动凸轮4，该活动凸轮4适于在覆盖基部构件的盖子5的按压时旋转，以使接触件2的接触部分2a从封装引线P2向外移位。 活动凸轮4分别设置有致动臂4c，该致动臂4c在按压盖5时与上推构件7抵接，随后凸轮4旋转以推动接收托盘6。

公开(公告)号：US5939891A

公开(公告)日：1999-08-17

申请号：US831056

申请日：1997-04-01

申请人： Nobuaki Kishi ,  Masanori Takagishi ,  Ichiro Matsuo

发明人： Nobuaki Kishi ,  Masanori Takagishi ,  Ichiro Matsuo

IPC分类号： H01R13/629 ,  H01L23/32 ,  H01R13/193 ,  H01R33/76 ,  H05K7/10 ,  H01R11/22

CPC分类号： H05K7/1023 ,  H01R13/193

摘要： A new socket is provided for testing an IC package whereby the contact parts of the contacts are moved outward to be able to conduct attachment and detachment of an IC package without a load, the oxide film formed on the contacts of the IC package is removed to acquire a reliable conductivity, and a stress to deform the contacts of the IC package cannot be exerted. In the socket, the contact parts of the contacts come into contact with the contacts of the IC package while sliding outward (in the opposite direction to the receiving space for the IC package), and remove the oxide films on the surfaces of the IC contacts to secure a reliable conductivity. When the IC package is taken out, the contact parts of the contacts move outward, the supporting point moves inward by the swing of the engaging member; and thereby, the contact parts of the contacts go up virtually vertically in the initial state of the movement, and afterward, move oblique outward to come off from the contacts of the IC package. Thus, the load to the contacts of the IC package can be reduced to so low a level as possible.

摘要翻译： 提供了用于测试IC封装的新插座，由此触点的接触部分向外移动以能够在没有负载的情况下进行IC封装的附接和拆卸，形成在IC封装的触点上的氧化膜被去除 获得可靠的导电性，并且不能施加使IC封装的触点变形的应力。 在插座中，触点的接触部分与IC封装的触点接触，同时向外滑动（与IC封装的接收空间相反的方向），并且去除IC触头表面上的氧化物膜 以确保可靠的电导率。 当IC封装被取出时，触头的接触部分向外移动，支撑点通过接合构件的摆动向内移动; 因此触点的接触部在运动的初始状态下几乎垂直地上升，然后向外斜向移动，从IC封装的触点脱离。 因此，可以将IC封装的触点的负载降低到尽可能低的水平。