PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM THEREOF, AND PRINTED WIRING BOARD USING THEM
    1.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM THEREOF, AND PRINTED WIRING BOARD USING THEM 有权
    光敏树脂组合物,其干膜及使用它们的印刷线路板

    公开(公告)号:US20120250268A1

    公开(公告)日:2012-10-04

    申请号:US13517648

    申请日:2012-06-14

    IPC分类号: G03F7/004 H05K1/03

    摘要: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating.

    摘要翻译: 碱显影性感光性树脂组合物包含具有联苯酚醛清漆结构的含羧基的聚氨酯树脂,光聚合引发剂和氢氧化铝和/或含磷化合物。 组合物可以配制成光固化性和热固性树脂组合物,除了上述组分之外,通过进一步掺入其中具有分子中具有多个环醚基和/或环硫醚基的热固性组分。 感光性树脂组合物还可以含有着色剂。 通过使用感光性树脂组合物或其干膜,可以提供由无卤素组合物形成的具有阻燃固化膜(例如阻焊剂)的印刷线路板,同时对环境施加很小的负担,固化 膜具有阻燃性并且翘曲变小并且具有各种优异的性能,包括弯曲特性,耐焊接热性和耐镀金性。

    PHOTOSENSITIVE RESIN, CURABLE RESIN COMPOSITION CONTAINING THE SAME, DRY FILM THEREOF, AND PRINTED CIRCUIT BOARD USING THEM
    2.
    发明申请
    PHOTOSENSITIVE RESIN, CURABLE RESIN COMPOSITION CONTAINING THE SAME, DRY FILM THEREOF, AND PRINTED CIRCUIT BOARD USING THEM 有权
    感光树脂,含有其的可固化树脂组合物,其干膜和使用它们的印刷电路板

    公开(公告)号:US20120061128A1

    公开(公告)日:2012-03-15

    申请号:US13231498

    申请日:2011-09-13

    IPC分类号: H05K1/03 G03F7/038 C08G8/32

    摘要: A carboxyl group-containing photosensitive resin is obtained by reacting an α,β-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.

    摘要翻译: 含羧基的感光性树脂通过使含有α,bgr-烯属不饱和基团的一元羧酸(c)与含有下述通式(I)所示的结构的酚类化合物(a)反应而得到, 其分子中的两个酚羟基,其中部分或全部酚羟基被修饰成氧烷基,并进一步使多元酸酐(d)与所得反应产物反应; 其中R1表示1〜11个碳原子的烃基,SO2基,氧原子和硫原子,R2表示碳原子数为1〜11的烃基,“a”表示0〜3的整数, “n”表示1〜2的整数,“m”表示1〜10的整数。