公开(公告)号：US20240258513A1

公开(公告)日：2024-08-01

申请号：US18634938

申请日：2024-04-13

Applicant: HYDRO-QUÉBEC

Inventor： Karim ZAGHIB ,  Dominic LEBLANC ,  Abdelbast GUERFI ,  Julie TROTTIER ,  Patrick CHAREST

IPC: H01M4/38 ,  C08B15/00 ,  C08B31/00 ,  C08B37/00 ,  C09K21/00 ,  C09K21/14 ,  H01M4/02 ,  H01M4/04 ,  H01M4/13 ,  H01M4/133 ,  H01M4/134 ,  H01M4/139 ,  H01M4/1395 ,  H01M4/36 ,  H01M4/40 ,  H01M4/485 ,  H01M4/587 ,  H01M4/62 ,  H01M4/66 ,  H01M10/052 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01M4/386 ,  C08B15/005 ,  C08B31/003 ,  C08B37/0045 ,  C09K21/00 ,  C09K21/14 ,  H01M4/0404 ,  H01M4/13 ,  H01M4/134 ,  H01M4/139 ,  H01M4/1395 ,  H01M4/364 ,  H01M4/405 ,  H01M4/485 ,  H01M4/587 ,  H01M4/622 ,  H01M4/623 ,  H01M4/625 ,  H01M4/661 ,  H01M4/663 ,  H01M4/666 ,  H01M10/052 ,  H05K1/0201 ,  H05K1/0313 ,  H05K1/0353 ,  H01M2004/027 ,  H01M4/133 ,  H05K1/0326 ,  H05K2201/012

Abstract: Provided herein are processes for making an anode containing an anode material, a protective material, and a current collector. The anode material is a mixture containing an active material, at least one electronically conductive agent and at least one binder. The active material may be an alloy of silicon and lithium or an alloy of silicon oxide and lithium. Processes also include use of the anodes in the fabrication of a battery.

公开(公告)号：US11700885B2

公开(公告)日：2023-07-18

申请号：US16652915

申请日：2018-10-25

Applicant: KT&G CORPORATION

Inventor： Jung Ho Han ,  Jae Sung Choi ,  Hun Il Lim ,  Tae Hun Kim ,  Hyung Jin Jung

IPC: A24F13/00 ,  A24F40/42 ,  A24F40/90 ,  A24F40/46 ,  A24B15/167 ,  A24F40/20 ,  A24F40/30 ,  A24D3/17 ,  A24D1/20 ,  A24F40/60 ,  F21V3/00 ,  F21V5/00 ,  G02B19/00 ,  H05B3/54 ,  A24F40/485 ,  A24F40/10 ,  A24F40/44 ,  A24F40/40 ,  A24F40/57 ,  A24F40/65 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  A24F40/50 ,  A24F40/95 ,  A24F15/01 ,  A24F40/51 ,  F21Y115/10

CPC classification number: A24F40/42 ,  A24B15/167 ,  A24D1/20 ,  A24D3/17 ,  A24F15/01 ,  A24F40/10 ,  A24F40/20 ,  A24F40/30 ,  A24F40/40 ,  A24F40/44 ,  A24F40/46 ,  A24F40/485 ,  A24F40/50 ,  A24F40/57 ,  A24F40/60 ,  A24F40/65 ,  A24F40/90 ,  A24F40/95 ,  F21V3/00 ,  F21V5/00 ,  G02B19/0009 ,  G02B19/0061 ,  H05B3/54 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/148 ,  H05K1/181 ,  A24F40/51 ,  F21Y2115/10 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/10219

Abstract: An aerosol generation device includes a case into which a cigarette is inserted, a heater disposed in the case and configured to heat the cigarette inserted into the case, a mainstream smoke passage connecting an end portion of the cigarette to the outside, and a pressure detection sensor configured to detect a change in a pressure of air inhaled to pass through the cigarette.

公开(公告)号：US20190241729A1

公开(公告)日：2019-08-08

申请号：US16318726

申请日：2017-07-18

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takao TANIGAWA ,  Tetsuroh IRINO ,  Minoru KAKITANI ,  Kouji MORITA

IPC: C08L39/04 ,  B32B15/08 ,  C08J5/18 ,  H05K1/03

CPC classification number: C08L39/04 ,  B32B15/08 ,  B32B27/34 ,  B32B2457/08 ,  C08J5/18 ,  C08J2339/04 ,  C08J2415/00 ,  C08J2425/06 ,  C08J2425/08 ,  C08J2427/18 ,  C08J2471/12 ,  C08K5/3415 ,  C08L35/00 ,  C08L101/00 ,  C08L2203/16 ,  C08L2203/206 ,  H05K1/03 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0129

Abstract: The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

公开(公告)号：US20190048137A1

公开(公告)日：2019-02-14

申请号：US15826861

申请日：2017-11-30

Applicant: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： WEN-CHIUNG SU ,  CHING-HSUAN LIN ,  WEI-FENG HSIAO ,  HAN-YA LIN

IPC: C08G65/48 ,  C08G65/40 ,  C08G59/40 ,  H05K1/03

CPC classification number: C08G65/48 ,  C08G59/4071 ,  C08G65/4012 ,  C08G2650/02 ,  C08G2650/40 ,  C08G2650/64 ,  H05K1/0326 ,  H05K1/0353 ,  H05K2201/012

Abstract: A low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether and a method of producing the same are introduced. Incorporation of a phosphorus group and a DCPD derivative into a low-k, non-flammable dicyclopentdiene (DCPD)-derived polyether enable the DCPD-derived polyether to not only serve as an epoxy resin curing agent but also cure itself such that the cured product not only features satisfactory thermal properties and low-k characteristics but is also non-flammable.

公开(公告)号：US20180327541A1

公开(公告)日：2018-11-15

申请号：US15527876

申请日：2015-11-10

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Tatsuya Okamoto

IPC: C08G59/40 ,  C08G63/197 ,  H05K1/03

CPC classification number: C08G59/40 ,  C08G63/181 ,  C08G63/197 ,  C08J5/24 ,  H01L23/29 ,  H01L23/295 ,  H01L23/31 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/0373 ,  H05K3/46 ,  H05K2201/012 ,  H05K2201/0145 ,  H01L2924/00

Abstract: Provided are a thermosetting resin composition whose cured product exhibits a low dielectric constant and a low loss tangent as well as excellent flame retardancy, heat resistance, and thermal decomposition resistance, a cured product obtained from the thermosetting resin composition, and an active ester resin for use in the thermosetting resin composition. Specifically, the thermosetting resin composition contains, as essential components, an epoxy resin and an active ester resin having a resin structure that has a structural segment represented by formula (I) below and monovalent aryloxy groups at both terminals:

公开(公告)号：US20180326708A1

公开(公告)日：2018-11-15

申请号：US15772848

申请日：2016-11-01

Applicant: ICL-IP America Inc.

Inventor： Andrew Piotrowski ,  Joseph Zilberman ,  Sergei V Levchik ,  Meng Zhang ,  Eran Gluz ,  Kali Ananth Suryadevara

IPC: B32B27/26 ,  B32B27/38 ,  C08G59/42 ,  C08G63/692 ,  C08J5/24 ,  H05K1/03

CPC classification number: B32B27/26 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/4071 ,  C08G59/4276 ,  C08G63/6926 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/012 ,  C08L67/00

Abstract: There is provided herein a flame retardant and curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.

公开(公告)号：US10045433B2

公开(公告)日：2018-08-07

申请号：US15629504

申请日：2017-06-21

Applicant: Kaneka Corporation

Inventor： Masayoshi Kido ,  Yoshihide Sekito

IPC: H05K1/02 ,  H05K1/03 ,  C09D5/33 ,  G03F7/027

CPC classification number: H05K1/0216 ,  C09D5/004 ,  G03F7/027 ,  H05K1/028 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/2054

Abstract: The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

公开(公告)号：US09994696B2

公开(公告)日：2018-06-12

申请号：US15358377

申请日：2016-11-22

Applicant: Chemtura Corporation

Inventor： Larry D. Timberlake ,  Mark V. Hanson

IPC: C08K3/32 ,  C08K5/5317 ,  C08L63/00 ,  C08J5/24 ,  B32B27/06 ,  B32B27/38 ,  C08J5/12 ,  C08J5/10 ,  B32B5/10 ,  H05K1/03 ,  H05K3/46 ,  C08K5/00

CPC classification number: C08K5/5317 ,  B32B5/10 ,  B32B27/06 ,  B32B27/38 ,  B32B2262/101 ,  B32B2307/3065 ,  B32B2363/00 ,  B32B2457/00 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/124 ,  C08J5/24 ,  C08J2363/00 ,  C08J2463/00 ,  C08K5/0066 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2203/1147 ,  C08K5/5333

Abstract: Resin compositions comprising flame retardant materials obtained by heating phosphonic acid salts at temperatures above 200° C., have excellent properties and exhibit manageable curing behavior. Laminates, composites, molded articles and the like, which have excellent flame retardant properties and physical characteristics, are readily prepared from the resin compositions of the invention.

公开(公告)号：US20180094003A1

公开(公告)日：2018-04-05

申请号：US15831454

申请日：2017-12-05

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C07F7/08 ,  C08K5/5419 ,  H05K1/03 ,  C08K9/06 ,  C08K5/5465 ,  C07F7/18 ,  C07F7/10

CPC classification number: C07F7/0878 ,  C07F7/081 ,  C07F7/0889 ,  C07F7/0896 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/016 ,  C08K5/5419 ,  C08K5/5465 ,  C08K9/06 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.

公开(公告)号：US20180086895A1

公开(公告)日：2018-03-29

申请号：US15515230

申请日：2016-09-14

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Jiang YOU ,  Tianhui HUANG ,  Yongjing XU ,  Zhongqiang YANG

IPC: C08K3/32 ,  C08L63/00 ,  C08G59/40 ,  C08L79/04 ,  C08G59/32 ,  C08K5/49

CPC classification number: C08K3/32 ,  B32B15/092 ,  B32B27/38 ,  C08G59/1477 ,  C08G59/3236 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/49 ,  C08L63/00 ,  C08L79/04 ,  C08L2201/02 ,  C08L2203/206 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/38 ,  H05K2201/012

Abstract: The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.