公开(公告)号：US20220271859A1

公开(公告)日：2022-08-25

申请号：US17180455

申请日：2021-02-19

Applicant: Nokia Solutions and Networks Oy

Inventor： Haoshuo Chen ,  Nicolas Fontaine ,  David Neilson

IPC: H04J14/02 ,  H04Q11/00 ,  H04B10/25

Abstract: Various example embodiments for a wavelength selective switch including a direct grating interface are presented. In at least some example embodiments, a wavelength selective switch may include a light propagating element having a tilted fiber grating integrated therein, thereby providing a direct grating interface to the light propagating element. It is noted that use of such a direct grating interface may obviate the need for use of various components typically utilized within wavelength selective switches (e.g., front-end optics in the port direction, front-end optics and diffractive gratings in the wavelength direction, and so forth), thereby enabling the size of wavelength selective switches to be reduced or even for the wavelength selective switches to be made compact or even ultra-compact.

公开(公告)号：US20200158967A1

公开(公告)日：2020-05-21

申请号：US16688436

申请日：2019-11-19

Applicant: Nokia Solutions and Networks Oy

Inventor： Peter Winzer ,  David Neilson ,  Shahriar Shahramian

IPC: G02B6/42

Abstract: An apparatus including an optical fiber connector module and an integrated optical device. The optical fiber connection module including an array of holes there-through for holding end segments of optical fibers therein such that the end of each of the optical fibers has a fixed distance relationship with an external surface of the module, the module having one or more electrical conductor lines therein with electrical contacts thereto along the external surface and having one or more first mechanical alignment structures along the external surface. The integrated optical device having one or more second mechanical alignment structures along an outer surface thereof, the first and second mechanical alignment structures capable of being fitted together such that the outer surface and external surface have a fixed relative positional relationship and such that the electrical contacts of the optical fiber connector module are adjacent to electrical contacts of the integrated optical device.

公开(公告)号：US20240007215A1

公开(公告)日：2024-01-04

申请号：US17965236

申请日：2022-10-13

Applicant: Nokia Solutions and Networks Oy

Inventor： John Simsarian ,  David Neilson ,  Roland Ryf

IPC: H04J14/02 ,  H04L49/1515

CPC classification number: H04J14/0209 ,  H04L49/1515

Abstract: Various example embodiments for supporting optical transport systems are presented. Various example embodiments for supporting optical transport systems may be configured to support optical transport systems that support multiple fibers based on use of spatial division multiplexing (SDM) techniques. Various example embodiments for supporting optical transport systems that support multiple fibers based on use of SDM techniques may be configured to support optical transport systems that support multiple fibers based on use of an anylane add/drop capability that is based on use of a Clos architecture (e.g., a spatially-switched distributed Clos architecture with a single stage of switching for network traffic that passes through the node, a spatially-switched distributed Clos architecture with two stages of switching for network traffic that passes through the node, a spatially-switched node-contained Clos architecture with three stages of switching for network traffic that passes through the node, or the like).

公开(公告)号：US20200158964A1

公开(公告)日：2020-05-21

申请号：US16688144

申请日：2019-11-19

Applicant: Nokia Solutions and Networks OY

Inventor： Peter Winzer ,  David Neilson ,  Po Dong

IPC: G02B6/42

Abstract: An optical interconnect circuit for transmitting data between two or more electronic chips. In an example embodiment, the optical interconnect circuit comprises two or more photonic chips, each of which is vertically stacked with the corresponding electronic chip such that compact optical modulators and/or photodetectors of the photonic chip are in close proximity to the data sources/sinks of the corresponding electronic chip. Multi-core optical fibers and vertical coupling structures are used to provide multiple optical connections between different photonic chips. Advantageously, the provided capability to place optical modulators close to the data sources and to place photodetectors close to the data sinks can be used to reduce the amount of required electrical wiring. Optical-waveguide connections to the multi-core fibers can be used to allow for high density of optical conduits without spatially constraining the placement of data sources and/or data sinks on the electronic chips.

公开(公告)号：US11041999B2

公开(公告)日：2021-06-22

申请号：US16688144

申请日：2019-11-19

Applicant: Nokia Solutions and Networks OY

Inventor： Peter Winzer ,  David Neilson ,  Po Dong

IPC: G02B6/42 ,  G02B6/02 ,  G02B6/34

Abstract: An optical interconnect circuit for transmitting data between two or more electronic chips. In an example embodiment, the optical interconnect circuit comprises two or more photonic chips, each of which is vertically stacked with the corresponding electronic chip such that compact optical modulators and/or photodetectors of the photonic chip are in close proximity to the data sources/sinks of the corresponding electronic chip. Multi-core optical fibers and vertical coupling structures are used to provide multiple optical connections between different photonic chips. Advantageously, the provided capability to place optical modulators close to the data sources and to place photodetectors close to the data sinks can be used to reduce the amount of required electrical wiring. Optical-waveguide connections to the multi-core fibers can be used to allow for high density of optical conduits without spatially constraining the placement of data sources and/or data sinks on the electronic chips.