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公开(公告)号：US10983276B2
公开(公告)日：2021-04-20
申请号：US15604817
申请日：2017-05-25
Applicant: Nokia Solutions and Networks OY
Inventor： Argishti Melikyan , Po Dong
Abstract: An optical device that can be used as an optical hybrid, e.g., in CMOS-compatible PICs. In an example embodiment, the optical device has a single optical input and four optical outputs. The two optical input signals to be mixed in the optical device are applied to the single optical input as transverse electric (TE) and transverse magnetic (TM) polarization components, respectively, of the corresponding polarization-multiplexed optical input signal. In response to the latter, the optical device causes the four outputs to receive four different relative-phase combinations of the two optical input signals, each combination being coupled into a TE waveguide mode at the respective optical output. A PIC having one or more instances of the optical device can be used, e.g., to implement a coherent optical receiver, wherein the TE and TM polarization components of the optical input signal are populated by a communication signal and a local-oscillator signal.
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公开(公告)号：US10649138B2
公开(公告)日：2020-05-12
申请号：US16138122
申请日：2018-09-21
Applicant: Nokia Solutions and Networks OY
Inventor： Po Dong , Kwangwoong Kim , Argishti Melikyan
Abstract: A photonic chip having a photonic-circuit layer supported on a substrate, the photonic-circuit layer including a suspended portion that extends beyond the outline of the substrate on the photonic-circuit layer. In various embodiments, the suspended portion may host one or more functional optical elements, such as an on-chip grating coupler, an on-chip microring resonator, and an on chip optical waveguide, that can be used to couple light in and out of the photonic chip. The geometry of the suspended portion enables unencumbered (e.g., double-sided) access to the one or more functional optical elements located therein and can advantageously be used to place an optical fiber and/or a second photonic chip sufficiently close to those functional optical elements to achieve a high chip-to-fiber or chip-to-chip optical-coupling efficiency.
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公开(公告)号：US11041999B2
公开(公告)日：2021-06-22
申请号：US16688144
申请日：2019-11-19
Applicant: Nokia Solutions and Networks OY
Inventor： Peter Winzer , David Neilson , Po Dong
Abstract: An optical interconnect circuit for transmitting data between two or more electronic chips. In an example embodiment, the optical interconnect circuit comprises two or more photonic chips, each of which is vertically stacked with the corresponding electronic chip such that compact optical modulators and/or photodetectors of the photonic chip are in close proximity to the data sources/sinks of the corresponding electronic chip. Multi-core optical fibers and vertical coupling structures are used to provide multiple optical connections between different photonic chips. Advantageously, the provided capability to place optical modulators close to the data sources and to place photodetectors close to the data sinks can be used to reduce the amount of required electrical wiring. Optical-waveguide connections to the multi-core fibers can be used to allow for high density of optical conduits without spatially constraining the placement of data sources and/or data sinks on the electronic chips.
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公开(公告)号：US20190250329A1
公开(公告)日：2019-08-15
申请号：US15897478
申请日：2018-02-15
Applicant: Nokia Solutions and Networks Oy
Inventor： Argishti Melikyan , Po Dong
CPC classification number: G02B6/125 , G02B6/1228 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , G02B2006/12147 , G02B2006/1215
Abstract: An apparatus includes a substrate having a planar surface and an optical waveguide having an optical core located on said substrate. The optical core is along and may even be parallel to said surface. A cross section of the optical core varies throughout a segment of the optical core. A light guiding direction of the optical waveguide bends through, at least, 90 degrees along the segment.
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公开(公告)号：US10295741B2
公开(公告)日：2019-05-21
申请号：US15476607
申请日：2017-03-31
Applicant: Nokia Solutions and Networks Oy
Inventor： Argishti Melikyan , Young-Kai Chen , Po Dong
Abstract: An optical apparatus comprising an optical device having an optical input-output face, at least two planar waveguide arms being located on a substrate, an optical splitter being located on the substrate, and, an optical grating coupler being located on the substrate. The optical splitter has an optical input and a plurality of optical outputs, each optical output being optically connected to a corresponding one of the planar waveguide arms. The optical grating coupler is connected to receive light from each planar waveguide arm and form diffraction pattern therefrom such that a principal maximum of one of the diffraction patterns overlaps with a principal maximum of another of the diffraction patterns on the optical input-output face of the optical device, the principal maxima of the one and another of the diffraction patterns being directed in different directions.
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Patent Agency Ranking
公开(公告)号：US11139894B2
公开(公告)日：2021-10-05
申请号：US17075387
申请日：2020-10-20
Applicant: Nokia Solutions and Networks Oy
Inventor： Po Dong
Abstract: An apparatus includes a laser, an optical power combiner, and an electronic controller. The laser has a plurality of modulatable optical reflectors and is operable to emit mutually coherent optical beams from the modulatable optical reflectors. The optical power combiner has a first optical inputs connected to receive light of one of the optical beams emitted from a first of the modulatable optical reflectors and has a second optical input connected to receive light of one of the optical beams emitted from a second of the modulatable optical reflectors. The electronic controller is connected to operate the first and second of the modulatable optical reflectors to modulate the optical beams emitted therefrom to carry respective first and second data streams. The optical power combiner is connected to interfere the light received from the first and second of the modulatable optical reflectors with a relative phase difference.
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公开(公告)号：US20210119707A1
公开(公告)日：2021-04-22
申请号：US17075387
申请日：2020-10-20
Applicant: Nokia Solutions and Networks Oy
Inventor： Po Dong
IPC: H04B10/50
Abstract: An apparatus includes a laser, an optical power combiner, and an electronic controller. The laser has a plurality of modulatable optical reflectors and is operable to emit mutually coherent optical beams from the modulatable optical reflectors. The optical power combiner has a first optical inputs connected to receive light of one of the optical beams emitted from a first of the modulatable optical reflectors and has a second optical input connected to receive light of one of the optical beams emitted from a second of the modulatable optical reflectors. The electronic controller is connected to operate the first and second of the modulatable optical reflectors to modulate the optical beams emitted therefrom to carry respective first and second data streams. The optical power combiner is connected to interfere the light received from the first and second of the modulatable optical reflectors with a relative phase difference.
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公开(公告)号：US10693275B2
公开(公告)日：2020-06-23
申请号：US15671231
申请日：2017-08-08
Applicant: Nokia Solutions and Networks OY
Inventor： Po Dong , Guilhem De Valicourt
Abstract: A directly modulated semiconductor laser whose optical output can be modulated by varying the transmittance of an end reflector of the laser cavity. In an example embodiment, the end reflector can be implemented using a lightwave circuit in which optical waveguides are arranged to form an optical interferometer. At least one of the optical waveguides may include a waveguide section configured to modulate the phase of an optical beam passing therethrough in response to an electrical radio-frequency drive signal in a manner that causes the transmittance and reflectance of the end reflector to be modulated accordingly. Advantageously, relatively high (e.g., >10 GHz) phase and/or amplitude modulation speeds of the optical output can be achieved in this manner to circumvent the inherent modulation-speed limitations of the laser's gain medium.
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公开(公告)号：US20200158964A1
公开(公告)日：2020-05-21
申请号：US16688144
申请日：2019-11-19
Applicant: Nokia Solutions and Networks OY
Inventor： Peter Winzer , David Neilson , Po Dong
IPC: G02B6/42
Abstract: An optical interconnect circuit for transmitting data between two or more electronic chips. In an example embodiment, the optical interconnect circuit comprises two or more photonic chips, each of which is vertically stacked with the corresponding electronic chip such that compact optical modulators and/or photodetectors of the photonic chip are in close proximity to the data sources/sinks of the corresponding electronic chip. Multi-core optical fibers and vertical coupling structures are used to provide multiple optical connections between different photonic chips. Advantageously, the provided capability to place optical modulators close to the data sources and to place photodetectors close to the data sinks can be used to reduce the amount of required electrical wiring. Optical-waveguide connections to the multi-core fibers can be used to allow for high density of optical conduits without spatially constraining the placement of data sources and/or data sinks on the electronic chips.
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公开(公告)号：US20200096702A1
公开(公告)日：2020-03-26
申请号：US16138122
申请日：2018-09-21
Applicant: Nokia Solutions and Networks OY
Inventor： Po Dong , Kwangwoong Kim , Argishti Melikyan
Abstract: A photonic chip having a photonic-circuit layer supported on a substrate, the photonic-circuit layer including a suspended portion that extends beyond the outline of the substrate on the photonic-circuit layer. In various embodiments, the suspended portion may host one or more functional optical elements, such as an on-chip grating coupler, an on-chip microring resonator, and an on chip optical waveguide, that can be used to couple light in and out of the photonic chip. The geometry of the suspended portion enables unencumbered (e.g., double-sided) access to the one or more functional optical elements located therein and can advantageously be used to place an optical fiber and/or a second photonic chip sufficiently close to those functional optical elements to achieve a high chip-to-fiber or chip-to-chip optical-coupling efficiency.
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