METHOD FOR FABRICATION OF SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD FOR FABRICATION OF SEMICONDUCTOR DEVICE 失效
    半导体器件制造方法

    公开(公告)号:US20080261357A1

    公开(公告)日:2008-10-23

    申请号:US11956858

    申请日:2007-12-14

    IPC分类号: H01L21/84

    摘要: After forming a source-drain material film on an insulator layer, an opening portion reaching the insulator layer is formed in the source-drain material film. Then, a channel having desired thickness and a gate insulator are sequentially formed on the insulator layer and the source-drain material film in the opening portion. Thereafter, a gate material film embedding the opening portion is formed on the gate insulator. Subsequently, a cap film is formed on the gate material film, thereby forming the gate made of the gate material film. Then, a mask layer is formed on the source-drain material film. Next, the source-drain material film not protected by the mask layer is removed while protecting the gate by the cap film, thereby leaving the source-drain material film on both sides of the gate. The source-drain material film on one side becomes the source and that on the other side becomes the drain.

    摘要翻译: 在绝缘体层上形成源极 - 漏极材料膜之后,在源极 - 漏极材料膜中形成到达绝缘体层的开口部分。 然后,在开口部分的绝缘体层和源极 - 漏极材料膜上依次形成具有期望厚度的沟道和栅极绝缘体。 此后,在栅极绝缘体上形成嵌入开口部的栅极材料膜。 随后,在栅极材料膜上形成盖膜,从而形成由栅极材料膜制成的栅极。 然后,在源极 - 漏极材料膜上形成掩模层。 接下来,除去未被掩模层保护的源极 - 漏极材料膜,同时通过盖膜保护栅极,从而在栅极的两侧留下源极 - 漏极材料膜。 一侧的源极 - 漏极材料膜成为源极,而另一侧的源极 - 漏极材料膜变成漏极。