公开(公告)号：US06830505B2

公开(公告)日：2004-12-14

申请号：US10648680

申请日：2003-08-25

申请人： Norihiko Moriya ,  Satoki Kanda ,  Takumi Kobayashi ,  Atsushi Kajikura

发明人： Norihiko Moriya ,  Satoki Kanda ,  Takumi Kobayashi ,  Atsushi Kajikura

IPC分类号： B24B700

CPC分类号： B24B37/08

摘要： The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper polishing plate and sandwiched between the polishing plates. Circular motion of the carriers, without revolving, are performed independently. Centers of gravity of the work pieces, which are held by the carriers, are simultaneously moved close to a center of gravity of the upper polishing plate and simultaneously moved away therefrom, and moving distances of the centers of gravity of the work pieces are equal.

摘要翻译： 抛光机能够均匀地将来自上抛光板的压力施加到容纳在载体的通孔中的工件上。 抛光机包括：多个载体，围绕上抛光板的重心设置并夹在该抛光板之间。 载体的圆周运动，无旋转，独立执行。 由载体保持的工件的重心同时移动靠近上抛光板的重心并同时从其移开，并且工件的重心移动距离相等。

公开(公告)号：US6080048A

公开(公告)日：2000-06-27

申请号：US114823

申请日：1998-07-14

申请人： Fuminari Kotagiri ,  Yoshio Nakamura ,  Yasuhide Denda ,  Haruo Sumizawa ,  Atsushi Kajikura ,  Satoki Kanda

发明人： Fuminari Kotagiri ,  Yoshio Nakamura ,  Yasuhide Denda ,  Haruo Sumizawa ,  Atsushi Kajikura ,  Satoki Kanda

IPC分类号： B24B37/08 ,  B24B47/04 ,  B24B5/00

CPC分类号： B24B37/08 ,  B24B41/067 ,  B24B47/04

摘要： The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier is formed into a thin plate having a through-hole in which a work piece is accommodated. An upper polishing plate polishes an upper face of the work piece. A lower polishing plate pinches the work piece with the upper polishing plate and polishes a lower face of the work piece. A driving mechanism moves the carrier along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece, which has been pinched between the polishing plates, are polished by the polishing plates.

摘要翻译： 本发明的研磨机能够提高工件的平坦度。 在抛光机中，载体形成为具有容纳工件的通孔的薄板。 上抛光板抛光工件的上表面。 下抛光板用上抛光板夹住工件并抛光工件的下表面。 驱动机构沿着圆形轨道在平面内移动载体而不旋转。 利用这种结构，被研磨板之间被夹持的工件的上表面和下表面被抛光板抛光。

公开(公告)号：US07485029B2

公开(公告)日：2009-02-03

申请号：US11882999

申请日：2007-08-08

申请人： Satoki Kanda ,  Harumichi Koyama ,  Masahiro Takeuchi ,  Yoichi Morozumi

发明人： Satoki Kanda ,  Harumichi Koyama ,  Masahiro Takeuchi ,  Yoichi Morozumi

IPC分类号： B24B7/00 ,  B24B9/00 ,  B24B57/02

CPC分类号： B24B37/015 ,  B24B37/08 ,  B24B57/02

摘要： The double face polishing apparatus is capable of controlling an amount of supplying slurry to a lower polishing plate. The double face polishing apparatus comprises: a lower polishing plate and an upper polishing plate; a carrier provided between the polishing plates, the carrier having a through-hole for holding a workpiece; a plate driving unit for rotating the polishing plates; a carrier driving unit for rotating the carrier; ring-shaped ducts coaxially provided to the upper polishing plate; a slurry supply source supplying slurry to the ring-shaped ducts; and supply pipes for supplying the slurry to the lower polishing plate. The slurry is supplied to each of coaxial polishing zones of the lower polishing plate via the corresponding ring-shaped ducts and the supply pipes.

摘要翻译： 双面抛光装置能够控制向下抛光板供给浆料的量。 双面抛光装置包括：下抛光板和上抛光板; 设置在所述研磨板之间的载体，所述载体具有用于保持工件的通孔; 用于旋转抛光板的板驱动单元; 用于使所述载体旋转的载体驱动单元; 同轴地设置到上抛光板的环形导管; 浆料供应源将浆料供应到环形管道; 并供应用于将浆料供应到下抛光板的管道。 通过相应的环形管道和供应管道将浆料供应到下抛光板的每个同轴抛光区域。

公开(公告)号：US20080057831A1

公开(公告)日：2008-03-06

申请号：US11882999

申请日：2007-08-08

申请人： Satoki Kanda ,  Harumichi Koyama ,  Masahiro Takeuchi ,  Yoichi Morozumi

发明人： Satoki Kanda ,  Harumichi Koyama ,  Masahiro Takeuchi ,  Yoichi Morozumi

IPC分类号： B24B49/14

CPC分类号： B24B37/015 ,  B24B37/08 ,  B24B57/02

摘要： The double face polishing apparatus is capable of controlling an amount of supplying slurry to a lower polishing plate. The double face polishing apparatus comprises: a lower polishing plate and an upper polishing plate; a carrier provided between the polishing plates, the carrier having a through-hole for holding a workpiece; a plate driving unit for rotating the polishing plates; a carrier driving unit for rotating the carrier; ring-shaped ducts coaxially provided to the upper polishing plate; a slurry supply source supplying slurry to the ring-shaped ducts; and supply pipes for supplying the slurry to the lower polishing plate. The slurry is supplied to each of coaxial polishing zones of the lower polishing plate via the corresponding ring-shaped ducts and the supply pipes.

摘要翻译： 双面抛光装置能够控制向下抛光板供给浆料的量。 双面抛光装置包括：下抛光板和上抛光板; 设置在所述研磨板之间的载体，所述载体具有用于保持工件的通孔; 用于旋转抛光板的板驱动单元; 用于使所述载体旋转的载体驱动单元; 同轴地设置到上抛光板的环形导管; 浆料供应源将浆料供应到环形管道; 并供应用于将浆料供应到下抛光板的管道。 通过相应的环形管道和供应管道将浆料供应到下抛光板的每个同轴抛光区域。