摘要:
To improve print quality, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity portion (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The elastic material constituting the adhesive layer (12) is arranged so that the elastic material is in a bonded state with respect to at least a part of a surface of the heat storage layer (13) opposed to the cavity portion (19).
摘要:
In order to provide a manufacturing method for a heating resistor element component, with which an insulating film (undercoat) can be easily handled, damage caused in the insulating film can be reduced, and a high yield can be ensured, the manufacturing method comprises the steps of: processing, on a surface of a supporting substrate (2), a plurality of concave portions (8) each forming a hollow portion (7) at intervals; processing, on the surface of the supporting substrate (2), a concave part (10) for each region straddling the plurality of concave portions (8) in an arrangement direction of the concave portions (8); placing an insulating film (3) made of sheet glass in each concave part (10); and bonding the insulating film (3) to the supporting substrate (2).
摘要:
The manufacturing method for a thermal head includes: forming a hollow concave portion and a marking concave portion having a depth larger than a depth of the hollow concave portion on one surface of a thin plate glass; a bonding step of bonding a supporting plate onto the one surface of the thin plate glass, in which the hollow concave portion and the marking concave portion are formed in the concave portion forming step; a thinning step of thinning the thin plate glass onto which the supporting plate is bonded in the bonding step until the marking concave portion extends through the substrate from a side of a back surface opposite to the one surface; and a heating resistor forming step of forming a heating resistor on the back surface of the thin plate glass thinned in the thinning step so as to be opposed to the hollow concave portion.
摘要:
To achieve improvements in heat generation efficiency and strength against external load, provided is a thermal head (1), comprising: a supporting substrate (3); a heat accumulating (5) bonded onto a surface of the supporting substrate (3); and a heating resistor (7) provided on the heat storage layer (5), wherein: a concave portion (2) is provided in a region, which is opposed to the heating resistor (7), of at least one of the surface of the supporting substrate (3) and a surface on a side of the supporting substrate (3) of the heat accumulating portion (5); and a center line of a hollow heat insulating layer (4) formed, by the concave portion (2), between the supporting substrate (3) and the heat storage layer (5) is shifted with respect to a center line (X) of the heating resistor (7).
摘要:
Provided is a heating resistance element component, including: a supporting substrate; an insulating film laminated on the supporting substrate; a plurality of heating resistors formed on the insulating film, the plurality of heating resistors being arranged in a zigzag shape along a main scanning direction and having a substantially square shape; a common wire connected to one end of each of the plurality of heating resistors; individual wires each connected to another end of the each of the plurality of heating resistors; and concave portions formed in regions which are opposed to the plurality of heating resistors and are located on a surface of the supporting substrate, in which an arrangement pitch of the plurality of heating resistors in a sub-scanning direction is larger than an arrangement pitch of the plurality of heating resistors in a main scanning direction.
摘要:
Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.
摘要:
Provided is a manufacturing method for a thermal head, which includes: a concave portion forming step of forming a plurality of concave portions on a surface of a collective substrate; a bonding step of thermally fusion bonding an insulating film to the surface of the collective substrate including the plurality of concave portions formed thereon in the concave portion forming step; and a heating resistor forming step of forming a plurality of heating resistors on the insulating film so as to be opposed to the plurality of concave portions, in which the concave portion forming step includes setting any one of the plurality of concave portions as a reference, and setting sizes of the plurality of concave portions other than the any one of the plurality of concave portions so as to become larger as a distance from the any one thereof increases.
摘要:
To reduce a plate thickness of an insulating film, a heating resistor element component is provided, which includes: a supporting substrate; an insulating film disposed on a surface of the supporting substrate; a plurality of heating resistors arranged at intervals on the insulating film; a common wire connected to one end of each of the plurality of heating resistors; and individual wires each connected to another end of each of the plurality of heating resistors, in which: the surface of the supporting substrate is provided with a concave portion in a region thereof, the region being opposed to heating portions of the plurality of heating resistors; and when the insulating film is superimposed on the supporting substrate, the insulating film includes a heterogeneous phase formed through irradiation of a phemtosecond laser at least in a region thereof, the region being opposed to the concave portion.
摘要:
Provided is a heating resistor element, including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces between the heating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the concave portion (16) has a curvature radius of 10 μm or more at each corner thereof. Accordingly, occurrence of stress concentration caused by heat or a load can be suppressed to improve durability, and both a sufficient strength and heating efficiency are realized.
摘要:
Provided is a heating resistor element including: an insulating substrate including a glass material; a heat accumulating layer bonded to the insulating substrate through heating to temperature ranging from an annealing point to a softening point in a state of being adhered to a surface of the insulating substrate, and including the same material as the glass material of the insulating substrate; and a heating resistor provided on the heat accumulating layer, in which, on at least one of bonded surfaces between the insulating substrate and the heat accumulating layer, at least one of the insulating substrate and the heat accumulating layer is provided with a concave portion in a region opposed to the heating resistor to form a hollow portion. Accordingly, deformation caused by a difference in coefficient of thermal expansion is suppressed to improve printing quality.