公开(公告)号：US4464420A

公开(公告)日：1984-08-07

申请号：US421833

申请日：1982-09-23

申请人： Noriyuki Taguchi ,  Tsuyoshi Fuzita ,  Gyozo Toda ,  Syoosaku Ishihara ,  Takashi Kuroki ,  Tatsuhiro Suzuki

发明人： Noriyuki Taguchi ,  Tsuyoshi Fuzita ,  Gyozo Toda ,  Syoosaku Ishihara ,  Takashi Kuroki ,  Tatsuhiro Suzuki

IPC分类号： H05K3/46 ,  H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/24 ,  B05D5/12

CPC分类号： H05K3/246 ,  H01L21/705 ,  H05K1/167 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K3/4667

摘要： A ceramic multilayer circuit board is provided by sintering a multilayer wiring substrate containing alumina as a main component, which was prepared by the green sheet process, nickel plating and gold plating in this order on the superficial wiring conductor layer, printing a thick film conductor paste on the gold plating layer, firing the printed substrate and finally printing a thick film resistor paste on at least part of the thick film conductor layer and firing to form a thick film resistor layer.

摘要翻译： 提供一种陶瓷多层电路板，其通过在表面布线导体层上依次烧结以氧化铝为主要成分的多层布线基板，其通过生片工艺，镀镍和镀金制备，印刷厚膜导体膏 在镀金层上烧制印刷基板，最后在厚膜导体层的至少一部分上印刷厚膜电阻浆料并进行焙烧以形成厚膜电阻层。