公开(公告)号：US06349871B1

公开(公告)日：2002-02-26

申请号：US09761616

申请日：2001-01-16

申请人： Norman A. Card, Jr. ,  James M. Ergler ,  James D. Herard ,  Paul R. Kasperek ,  Richard S. McKinley ,  Der-jin Woan

发明人： Norman A. Card, Jr. ,  James M. Ergler ,  James D. Herard ,  Paul R. Kasperek ,  Richard S. McKinley ,  Der-jin Woan

IPC分类号： B23K3102

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K2101/42 ,  H05K3/26 ,  H05K2203/0445 ,  H05K2203/045 ,  H05K2203/081

摘要： A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through hole or holes to be reworked. The heating device is removed when the solder in the plugged PTH is completely melted. At that time, blast air is turned on to remove and blow off the excess solder in the PTH. The compressed air is more effective in displacing the molten solder than is vacuuming, and has less chance of damaging the PCB than do conventional reworking methods, due to the non-contact nature of the invention.

摘要翻译： 描述了一种用于重新加工具有插入通孔和电镀通孔的印刷电路板的方法和装置。 由可移动的局部支撑件支撑的印刷电路板仅通过加热装置从底部被加热，该加热装置靠近PCB上的区域，其中包含要进行返工的电镀通孔或孔。 当堵塞的PTH中的焊料完全熔化时，取出加热装置。 此时，打开鼓风空气去除和吹除PTH中多余的焊料。 由于本发明的非接触性质，压缩空气比抽真空更有效地替代熔融焊料，并且比传统的返工方法具有较少的损坏PCB的可能性。

公开(公告)号：US06216938B1

公开(公告)日：2001-04-17

申请号：US09409832

申请日：1999-09-30

申请人： Norman A. Card, Jr. ,  James M. Ergler ,  James D. Herard ,  Paul R. Kasperek ,  Richard S. McKinley ,  Der-jin Woan

发明人： Norman A. Card, Jr. ,  James M. Ergler ,  James D. Herard ,  Paul R. Kasperek ,  Richard S. McKinley ,  Der-jin Woan

IPC分类号： B23K1018

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K2101/42 ,  H05K3/26 ,  H05K2203/0445 ,  H05K2203/045 ,  H05K2203/081

摘要： A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through hole or holes to be reworked. The heating device is removed when the solder in the plugged PTH is completely melted. At that time, blast air is turned on to remove and blow off the excess solder in the PTH. The compressed air is more effective in displacing the molten solder than is vacuuming, and has less chance of damaging the PCB than do conventional reworking methods, due to the non-contact nature of the invention.

摘要翻译： 描述了一种用于重新加工具有插入通孔和电镀通孔的印刷电路板的方法和装置。 由可移动的局部支撑件支撑的印刷电路板仅通过加热装置从底部被加热，该加热装置靠近PCB上的区域，其中包含要进行返工的电镀通孔或孔。 当堵塞的PTH中的焊料完全熔化时，取出加热装置。 此时，打开鼓风空气去除和吹除PTH中多余的焊料。 由于本发明的非接触性质，压缩空气比抽真空更有效地替代熔融焊料，并且比传统的返工方法具有较少的损坏PCB的可能性。