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    Printed circuit board assembly tooling
    1.
    发明授权
    Printed circuit board assembly tooling 有权
    印刷电路板组装工具

    公开(公告)号：US08850695B1

    公开(公告)日：2014-10-07

    申请号：US12652091

    申请日：2010-01-05

    申请人： Norman L. Call ,  Jose M. Chavez ,  Rodolfo Chavez

    发明人： Norman L. Call ,  Jose M. Chavez ,  Rodolfo Chavez

    IPC分类号： B23P19/00

    CPC分类号： H05K3/30 ,  H05K3/007 ,  H05K13/04 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53265 ,  Y10T156/10

    摘要： Printed circuit board (PCB) assembly tooling and methods are provided. Particular tooling includes a first tooling fixture having a first core component receiver to receive a first portion of a magnetic core to be coupled to a first side of a PCB. The tooling also has a second tooling fixture including a second core component receiver to receive a second portion of the magnetic core to be coupled on a second side of the PCB to the first portion of the magnetic core. The tooling also has an alignment component disposed on at least one of the first tooling fixture and the second tooling fixture. The alignment component enables alignment of the first tooling fixture and the second tooling fixture. When the first tooling fixture and the second tooling fixture are aligned, the first portion of the magnetic core and the second portion of the magnetic core are aligned.

    摘要翻译： 提供印刷电路板（PCB）组装工具和方法。 具体的工具包括第一工具夹具，其具有第一芯部件接收器，用于接收要耦合到PCB第一侧的磁芯的第一部分。 工具还具有第二工具夹具，其包括第二芯部件接收器，用于接收待耦合在PCB的第二侧上的磁芯的第二部分到磁芯的第一部分。 工具还具有设置在第一工具夹具和第二工具夹具中的至少一个上的对准部件。 对准部件使得能够对准第一工具和第二工具。 当第一工具夹具和第二工具夹具对齐时，磁芯的第一部分和磁芯的第二部分对齐。

    PRINTED CIRCUIT BOARD ASSEMBLY METHODS
    2.
    发明申请
    PRINTED CIRCUIT BOARD ASSEMBLY METHODS 有权
    印刷电路板组装方法

    公开(公告)号：US20150090390A1

    公开(公告)日：2015-04-02

    申请号：US14504208

    申请日：2014-10-01

    申请人： Norman L. Call ,  Jose M. Chavez ,  Rodolfo Chavez

    发明人： Norman L. Call ,  Jose M. Chavez ,  Rodolfo Chavez

    IPC分类号： H05K3/30 ,  H05K13/04

    CPC分类号： H05K3/30 ,  H05K3/007 ,  H05K13/04 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53265 ,  Y10T156/10

    摘要： A method includes aligning a first portion of a magnetic core with respect to a first side of a PCB using a first alignment device. The method includes applying a first bonding material to a surface of at least one of the first portion of the magnetic core and a second portion of the magnetic core. The method further includes coupling a second alignment device that retains the second portion of the magnetic core to the first alignment device. When the first alignment device and the second alignment device are coupled, the first portion and the second portion of the magnetic core are retained in a specified assembly position. The specified assembly position includes a specified gap between the first portion and the second portion of the magnetic core. The method also includes curing the first bonding material.

    摘要翻译： 一种方法包括使用第一对准装置将磁芯的第一部分相对于PCB的第一侧对准。 该方法包括将第一接合材料施加到磁芯的第一部分和磁芯的第二部分中的至少一个的表面上。 该方法还包括将保持磁芯的第二部分的第二对准装置耦合到第一对准装置。 当第一对准装置和第二对准装置联接时，磁芯的第一部分和第二部分保持在指定的组装位置。 指定的组装位置包括在磁芯的第一部分和第二部分之间的指定间隙。 该方法还包括固化第一接合材料。