公开(公告)号：US20150062248A1

公开(公告)日：2015-03-05

申请号：US14537350

申请日：2014-11-10

Applicant: OCE-TECHNOLOGIES B.V.

Inventor： Norbert H. W. LAMERS

IPC: H01L23/00 ,  B41J2/14

CPC classification number: H01L24/27 ,  B41J2/14 ,  B41J2/14024 ,  H01L24/83 ,  H01L2224/27312 ,  H01L2224/278 ,  H01L2224/83047 ,  H01L2224/83143 ,  H01L2224/8385

Abstract: A method is provided for bonding a chip to a substrate, the method comprising the steps of providing a chip, providing a substrate, providing a recess in one of the chip and the substrate, arranging the chip and the substrate in contact with each other thereby forming a predetermined contact area and at least partly covering the recess by the other one of the chip and the substrate, and providing an amount of liquid adhesive in the recess for providing a bonding layer.

Abstract translation: 提供一种用于将芯片接合到基板的方法，该方法包括以下步骤：提供芯片，提供基板，在芯片和基板之一中提供凹槽，使芯片和基板彼此接触，从而 形成预定的接触面积，并且通过芯片和衬底中的另一个至少部分地覆盖凹部，并且在凹部中提供一定量的液体粘合剂以提供粘合层。