公开(公告)号：US11627240B2

公开(公告)日：2023-04-11

申请号：US16921236

申请日：2020-07-06

Applicant: OLYMPUS CORPORATION

Inventor： Hiroshi Kobayashi ,  Takatoshi Igarashi

IPC: H04N5/225 ,  G02B23/24 ,  A61B1/04

Abstract: An image pickup apparatus for endoscope includes: an optical unit having an incident surface and an emitting surface; an image pickup unit adhering to the emitting surface; an interposer where the image pickup unit is bonded to a first electrode of a first main surface; and an electric cable bonded to the interposer. The image pickup unit is smaller than the optical unit and the interposer in an outer size in a direction orthogonal to an optical axis. The image pickup apparatus for endoscope further includes a heat conductive resin with which a portion among the emitting surface, the first main surface, and a side surface of the image pickup unit is filled. The first electrode extends to a position where the first electrode is brought into contact with the heat conductive resin.

公开(公告)号：US11631649B2

公开(公告)日：2023-04-18

申请号：US17345532

申请日：2021-06-11

Applicant: OLYMPUS CORPORATION

Inventor： Hiroshi Kobayashi

IPC: H01L23/00

Abstract: A bonded body includes: a first base body including a first wiring, a first electrode made of an electroplating film and including a first surface having a first region covering a periphery of an end portion of the first wiring and a second region covering the end portion of the first wiring, and a first passivation layer made of an insulating material and covering a periphery of the first electrode; a second base body including a second electrode; and solder disposed between the first region of the first electrode and the second electrode.

公开(公告)号：US10757301B2

公开(公告)日：2020-08-25

申请号：US16403782

申请日：2019-05-06

Applicant: OLYMPUS CORPORATION

Inventor： Ken Yamamoto ,  Takuro Suyama ,  Takahiro Shimohata ,  Takatoshi Igarashi ,  Hiroshi Kobayashi

IPC: A61B1/04 ,  H04N5/225 ,  A61B1/05 ,  H01L27/146 ,  H01L25/065 ,  H01L25/18 ,  H04N5/369 ,  H01L27/14 ,  H01L25/07

Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.

公开(公告)号：US11179025B2

公开(公告)日：2021-11-23

申请号：US16676642

申请日：2019-11-07

Applicant: OLYMPUS CORPORATION

Inventor： Hiroshi Kobayashi ,  Takahiro Shimohata

IPC: A61B1/00 ,  A61B1/05 ,  A61B1/06

Abstract: An image pickup apparatus includes: an optical unit including an incident surface and an emission surface, in which a plurality of optical members are arranged around an optical axis; a polygonal prism image pickup unit including a light receiving surface, a rear surface and a plurality of side faces, in which a plurality of elements including an image pickup device configured to photoelectrically convert light made incident from the optical unit and output an image pickup signal are laminated; and at least one guide, a front portion of which is fixed to the emission surface of the optical unit and a rear portion of which is provided with a plurality of contact surfaces that are respectively in contact with and fixed to the plurality of side faces of the image pickup unit.