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公开(公告)号：US11323598B2
公开(公告)日：2022-05-03
申请号：US16924280
申请日：2020-07-09
Applicant: OLYMPUS CORPORATION
Inventor： Ken Yamamoto , Takatoshi Igarashi , Takuro Suyama , Kazuhiro Yoshida , Kensuke Suga
IPC: H04N5/225 , A61B1/00 , A61B1/05 , G02B23/24 , H01L27/146
Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.
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2.发明授权公开(公告)号：US11096567B2
公开(公告)日：2021-08-24
申请号：US16662882
申请日：2019-10-24
Applicant: Olympus Corporation
Inventor： Ken Yamamoto , Takuro Suyama
Abstract: An endoscope system includes an endoscope having an insertion portion. The endoscope is attached to the proximal end of the insertion portion. An image capturing module is attached to the distal-end portion of an insertion portion. The image capturing module includes a wiring board having a principal surface including first electrodes and second electrodes disposed thereon. An image capturing element includes respective photodetection and reverse surfaces. The reverse surface includes external electrodes and is connected to the first electrodes on the wiring board. A prism having an entrance surface to which light is applied, a reflection surface, and an exit surface in which the exit surface being bonded to the photodetection surface of the image capturing element. A support member is used to support the prism. A layered element including a plurality of elements is layered together and having an upper surface, a lower surface with element electrodes disposed thereon.
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公开(公告)号：US10665538B2
公开(公告)日：2020-05-26
申请号：US15959343
申请日：2018-04-23
Applicant: OLYMPUS CORPORATION
Inventor： Takuro Suyama
IPC: H01L23/522 , H01L23/48 , H01L21/768
Abstract: A semiconductor apparatus includes a semiconductor device having a semiconductor circuit formed on a first main surface, and including a via having an opening at a second main surface, a first wiring disposed on the first main surface of the semiconductor device, partially exposed at a bottom surface of the via, and connected to the semiconductor circuit, a first insulating layer covering the first wiring, and a redistribution wiring extending from a contact portion in contact with the first wiring at the bottom surface of the via, through an inside of the via and onto the second main surface, where a first through hole is formed in the first wiring, and the contact portion is in contact with a plurality of surfaces of the first wiring.
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公开(公告)号：US10213096B2
公开(公告)日：2019-02-26
申请号：US15650997
申请日：2017-07-17
Applicant: OLYMPUS CORPORATION
Inventor： Takuro Suyama
IPC: A61B1/04 , H01L27/146 , A61B1/005 , A61B1/00 , H04N5/225
Abstract: An image pickup apparatus includes a silicon layer, a rewiring layer including low-permittivity insulating bodies having a permittivity that is lower than a permittivity of silicon oxide, and a cover glass, and a cutout portion is provided in the silicon layer, wirings are provided on the cutout portion, the wirings do not cover at least a part of the low-permittivity insulating bodies in the rewiring layer, the low-permittivity insulating body being exposed at the cutout portion, and the cutout portion is covered by a second protection film including a metal material via a first protection film including an insulating material.
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公开(公告)号：US11955498B2
公开(公告)日：2024-04-09
申请号：US17864678
申请日：2022-07-14
Applicant: OLYMPUS CORPORATION
Inventor： Mitsuru Hagihara , Takuro Suyama
CPC classification number: H01L27/14632 , A61B1/04 , G02B23/2484 , H01L27/1469 , H04N23/51 , H04N23/54 , A61B1/051 , H04N23/555
Abstract: An image pickup apparatus includes an image pickup member including an image pickup device, a stacked device in which a plurality of semiconductor devices are stacked, a wiring board having a first principal surface and a second principal surface, the wiring board including a central section having a substrate thicker than the image pickup device, an intermediate section that is extended from the central section and is bent, and a terminal section that is extended from the intermediate section, the image pickup member being bonded to the first principal surface of the central section, the stacked device being bonded to the second principal surface of the central section, and a plurality of signal cables bonded to the terminal section.
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Patent Agency Ranking
公开(公告)号：US11832796B2
公开(公告)日：2023-12-05
申请号：US17957305
申请日：2022-09-30
Applicant: OLYMPUS CORPORATION
Inventor： Takuro Suyama
CPC classification number: A61B1/04 , A61B1/00009 , A61B1/00096 , A61B1/051 , A61B1/0011
Abstract: An imaging module includes an imager having an optical member on a light receiving surface, an electronic component having a front surface facing the same direction as the one to which an incidence surface of the optical member faces, a resin portion that has a first surface flush with the incidence surface of the optical member and the front surface of the electronic component, and a second surface that is a surface on a side opposite to the first surface while having the imager and the electronic component being embedded therein such that the incidence surface and the front surface are exposed to the first surface, an external connection terminal provided on the second surface, and a through wiring that extends through the resin portion to connect at least one of the imager and the electronic component with the external connection terminal.
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公开(公告)号：US10757301B2
公开(公告)日：2020-08-25
申请号：US16403782
申请日：2019-05-06
Applicant: OLYMPUS CORPORATION
Inventor： Ken Yamamoto , Takuro Suyama , Takahiro Shimohata , Takatoshi Igarashi , Hiroshi Kobayashi
IPC: A61B1/04 , H04N5/225 , A61B1/05 , H01L27/146 , H01L25/065 , H01L25/18 , H04N5/369 , H01L27/14 , H01L25/07
Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.
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公开(公告)号：US10514535B2
公开(公告)日：2019-12-24
申请号：US15402583
申请日：2017-01-10
Applicant: OLYMPUS CORPORATION
Inventor： Takuro Suyama
Abstract: An image pickup unit of an embodiment includes: a first substrate on which an image pickup device is mounted; a first intermediate wiring board including a first wire, one end of the first wire electrically connected to the first substrate, the other end of the first wire including a first electrode pad; a second substrate on which an electronic component is mounted; and a second intermediate wiring board including a second wire, one end of the second wire electrically connected to the second substrate, and the other end of the second wire including a second electrode pad, wherein the first electrode pad and the second electrode pad coming into close contact and fixed in an electrically connected state are bent and deformed.
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公开(公告)号：US20190175004A1
公开(公告)日：2019-06-13
申请号：US16280335
申请日：2019-02-20
Applicant: Olympus Corporation
Inventor： Takuro Suyama , Takatoshi Igarashi , Kensuke Suga
Abstract: The disclosed technology is directed to an imaging module of an endoscope comprises a plurality of semiconductor devices includes first and second semiconductor devices being electrically stacked to one another with a sealing layer interposed therebetween to transmit signals via a signal cable connected to a rear wall of the plurality of semiconductor devices. The first semiconductor device includes respective opposed first and second major surfaces having a first central region. The first major surface includes a semiconductor circuit portion disposed in the central region thereof. A through-silicon via is disposed in an intermediate region surrounding the first central region and is connected to the semiconductor circuit portion. The second major surface includes a first electrode located in the first central region thereof. The first electrode is connected to the through-silicon via. The second semiconductor device includes respective opposed third and fourth major surfaces having a second central region.
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公开(公告)号：US12028597B2
公开(公告)日：2024-07-02
申请号：US17868929
申请日：2022-07-20
Applicant: OLYMPUS CORPORATION
Inventor： Takuro Suyama , Ken Yamamoto , Takatoshi Igarashi
CPC classification number: H04N23/54 , A61B1/04 , A61B1/051 , H04N23/555
Abstract: An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.
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