公开(公告)号：US11955498B2

公开(公告)日：2024-04-09

申请号：US17864678

申请日：2022-07-14

Applicant: OLYMPUS CORPORATION

Inventor： Mitsuru Hagihara ,  Takuro Suyama

IPC: H01L27/146 ,  A61B1/04 ,  G02B23/24 ,  H04N23/50 ,  H04N23/51 ,  H04N23/54 ,  A61B1/05

CPC classification number: H01L27/14632 ,  A61B1/04 ,  G02B23/2484 ,  H01L27/1469 ,  H04N23/51 ,  H04N23/54 ,  A61B1/051 ,  H04N23/555

Abstract: An image pickup apparatus includes an image pickup member including an image pickup device, a stacked device in which a plurality of semiconductor devices are stacked, a wiring board having a first principal surface and a second principal surface, the wiring board including a central section having a substrate thicker than the image pickup device, an intermediate section that is extended from the central section and is bent, and a terminal section that is extended from the intermediate section, the image pickup member being bonded to the first principal surface of the central section, the stacked device being bonded to the second principal surface of the central section, and a plurality of signal cables bonded to the terminal section.