公开(公告)号：US20200367734A1

公开(公告)日：2020-11-26

申请号：US16993354

申请日：2020-08-14

Applicant: OLYMPUS CORPORATION

Inventor： Toshiyuki SHIMIZU

IPC: A61B1/05 ,  H04N5/225 ,  A61B1/00

Abstract: An imaging unit includes: a semiconductor package including an imaging device and having a back surface on which a sensor electrode is formed; a circuit substrate including a connection electrode that is connected to the sensor electrode via a bump; a surrounding part configured to cover the semiconductor package and the circuit substrate; a filler with which a space that is enclosed by the surrounding part is filled to seal a circumference of the semiconductor package and the circuit substrate; and a first cover configured to prevent the filler from infiltrating a joint between the semiconductor package and the circuit substrate.

公开(公告)号：US20190021582A1

公开(公告)日：2019-01-24

申请号：US16127326

申请日：2018-09-11

Applicant: OLYMPUS CORPORATION

Inventor： Toshiyuki SHIMIZU

IPC: A61B1/05 ,  A61B1/00 ,  H01L27/146

Abstract: An imaging unit includes: a semiconductor package that includes a light receiver of an imaging element formed on a front surface of the semiconductor package, and a sensor electrode formed on a back surface of the semiconductor package; a circuit board that includes a connection electrode electrically and mechanically connected to the sensor electrode through a bump on a front surface of the circuit board; an enclosing member configured to enclose the semiconductor package; a first filler that is filled in space enclosed by the enclosing member; and a second filler that is filled on a joint surface between the semiconductor package and the circuit board, and that has a smaller linear expansion per unit length at sterilization temperature than that of the first filler.

公开(公告)号：US20170150875A1

公开(公告)日：2017-06-01

申请号：US15431889

申请日：2017-02-14

Applicant: OLYMPUS CORPORATION

Inventor： Toshiyuki SHIMIZU ,  Hiroyuki MOTOHARA ,  Toshiyuki FUJII ,  Shinya ISHIKAWA

IPC: A61B1/05 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00

CPC classification number: A61B1/051 ,  A61B1/0011 ,  A61B1/00124 ,  A61B1/04 ,  G02B23/24 ,  G02B23/2484 ,  H01L27/14 ,  H01L27/14618 ,  H01L27/14683

Abstract: An imaging module includes: a chip size package having an image sensor that has a light receiving unit on a front side of the image sensor, the chip size package having connection lands on a back side of the image sensor; a circuit board having connection electrodes being electrically and mechanically connected to the connection lands of the chip size package through bumps; and an underfill material filled into a gap between the chip size package and the circuit board. The circuit board and the underfill material are provided within a projection plane on which the chip size package is projected in an optical axis direction of the image sensor. The circuit board has a cutout portion on a side surface thereof orthogonal to a connection surface of the circuit board with the chip size package such that the cutout portion is open to at least the connection surface.