公开(公告)号：US20160029879A1

公开(公告)日：2016-02-04

申请号：US14881590

申请日：2015-10-13

Applicant: OLYMPUS CORPORATION

Inventor： Shinya ISHIKAWA

IPC: A61B1/05 ,  A61B1/005 ,  A61B1/00

CPC classification number: A61B1/051 ,  A61B1/00114 ,  A61B1/00124 ,  A61B1/005 ,  G02B23/24 ,  G02B23/2484 ,  H04N5/225 ,  H04N5/2251 ,  H04N2005/2255

Abstract: An image pickup unit for an endoscope includes: an image pickup device including a plurality of connection terminal portions arrayed on a back face that is a surface opposite to a light-receiving surface; a planar rigid printed wiring board including a substrate connection portion and an electric cable connection portion; a flexible printed wiring board including a fixation portion connected to the image pickup device and the rigid printed wiring board, an extension portion extending from an outer periphery of the fixation portion, and a flexed portion provided at a boundary between the fixation portion and the extension portion; an electric cable connected to the electric cable connection portion of the rigid printed wiring board; and an electronic component mounted on the extension portion of the flexible printed wiring board.

Abstract translation: 一种用于内窥镜的图像拾取单元，包括：图像拾取装置，包括排列在与光接收表面相对的表面的背面上的多个连接端子部; 包括基板连接部分和电缆连接部分的平面刚性印刷线路板; 柔性印刷布线板，包括连接到图像拾取装置和刚性印刷布线板的固定部分，从固定部分的外周延伸的延伸部分和设置在固定部分和延伸部分之间的边界处的弯曲部分 一部分; 连接到刚性印刷线路板的电缆连接部分的电缆; 以及安装在柔性印刷电路板的延伸部分上的电子部件。

公开(公告)号：US20170150875A1

公开(公告)日：2017-06-01

申请号：US15431889

申请日：2017-02-14

Applicant: OLYMPUS CORPORATION

Inventor： Toshiyuki SHIMIZU ,  Hiroyuki MOTOHARA ,  Toshiyuki FUJII ,  Shinya ISHIKAWA

IPC: A61B1/05 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00

CPC classification number: A61B1/051 ,  A61B1/0011 ,  A61B1/00124 ,  A61B1/04 ,  G02B23/24 ,  G02B23/2484 ,  H01L27/14 ,  H01L27/14618 ,  H01L27/14683

Abstract: An imaging module includes: a chip size package having an image sensor that has a light receiving unit on a front side of the image sensor, the chip size package having connection lands on a back side of the image sensor; a circuit board having connection electrodes being electrically and mechanically connected to the connection lands of the chip size package through bumps; and an underfill material filled into a gap between the chip size package and the circuit board. The circuit board and the underfill material are provided within a projection plane on which the chip size package is projected in an optical axis direction of the image sensor. The circuit board has a cutout portion on a side surface thereof orthogonal to a connection surface of the circuit board with the chip size package such that the cutout portion is open to at least the connection surface.

公开(公告)号：US20200337538A1

公开(公告)日：2020-10-29

申请号：US16924631

申请日：2020-07-09

Applicant: OLYMPUS CORPORATION

Inventor： Shinya ISHIKAWA

IPC: A61B1/05 ,  A61B1/00 ,  A61B1/06

Abstract: An oblique-viewing endoscope includes: an endoscope axis that is a longitudinal direction of an endoscope distal end portion; an optical axis of a lens, the optical axis being an observing direction, the endoscope axis and the optical axis being disposed to form a predetermined inclination angle with respect to each other; a rectangular semiconductor package including an imaging sensor configured to convert an optical image formed by the lens to an image signal, and a terminal formed on a back face of the semiconductor package; and a rigid substrate including a semiconductor package mounting area in which the semiconductor package is mounted, an electronic component mounting area in which an electronic component is mounted, and a cable mounting area in which a cable is mounted.

公开(公告)号：US20170164818A1

公开(公告)日：2017-06-15

申请号：US15442768

申请日：2017-02-27

Applicant: OLYMPUS CORPORATION

Inventor： Shinya ISHIKAWA ,  Yuichi WATAYA ,  Akira MURAMATSU

IPC: A61B1/04 ,  G02B23/24 ,  H01L27/146 ,  H04N5/225 ,  A61B1/00 ,  H01L23/498

CPC classification number: H01L27/14618 ,  A61B1/00045 ,  A61B1/04 ,  A61B1/051 ,  G02B23/2484 ,  H01L23/04 ,  H01L23/041 ,  H01L23/053 ,  H01L23/12 ,  H01L23/32 ,  H01L23/488 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/538 ,  H01L27/146 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L31/0203 ,  H01L2924/0002 ,  H04N5/2256 ,  H04N2005/2255 ,  H01L2924/00

Abstract: An imaging unit includes: a semiconductor package having an image sensor and having a first connection electrode on a back face thereof; a first multi-layer substrate having layered substrates and having second and third connection electrodes respectively on front and back faces of the first multi-layer substrate, the second connection electrode being configured to be connected to the first connection electrode; a second multi-layer substrate having layered substrates, the second multi-layer substrate being configured to be connected to the back face of the first multi-layer substrate such that a layer direction of the second multi-layer substrate is perpendicular to a layer direction of the first multi-layer substrate; an electronic component mounted inside the first multi-layer substrate; and cables configured to be connected to the second multi-layer substrate. The first and second multi-layer substrates lie within a projected plane in an optical axis direction of the semiconductor package.