公开(公告)号：US20170076893A1

公开(公告)日：2017-03-16

申请号：US15125195

申请日：2014-11-21

Applicant: OMRON Corporation

Inventor： Kazuhiro TSUTSUI ,  Masahiro KINOSHITA ,  Ayaka MIYAKE ,  Jun SASAKI ,  Keisuke TSUJI

IPC: H01H50/02 ,  H01H50/04

CPC classification number: H01H50/023 ,  H01H49/00 ,  H01H50/041 ,  H01H50/043

Abstract: An electronic-device seal structure includes a base, a case which covers an upper surface of the base and has an opening at a surface thereof, and a pair of terminals attached to the base. A first clearance sealed with a sealing material is provided between the base and the case, and a second clearance is provided between the pair of terminals attached to an end surface of the base to face each other.

Abstract translation: 电子装置密封结构包括基座，覆盖基座的上表面并且在其表面具有开口的壳体和附接到基座的一对端子。 在基座和壳体之间设置密封有密封材料的第一间隙，并且在连接到基座的端面的一对端子之间提供第二间隙以彼此面对。