公开(公告)号：US20140140205A1

公开(公告)日：2014-05-22

申请号：US13681052

申请日：2012-11-19

Applicant: ORACLE INTERNATIONAL CORPORATION

Inventor： Robert P. Masleid ,  Paul J. Dickinson ,  Murali M. R. Gala ,  Karl P. Dahlgren

IPC: H04L29/14

CPC classification number: H04L29/14 ,  H04L49/109 ,  H04L49/557

Abstract: A method and apparatus for post-silicon repair of on-die networks is disclosed. In one embodiment, an integrated circuit includes a first network node of an on-chip network configured to couple each of a plurality of functional units to at least one other one of the plurality of functional units. The first network node includes a plurality of ports. Each of the plurality of ports includes a plurality of multiplexers configured to substitute a spare channel of the network node into the network responsive to a test determining that another one of a plurality of channels is defective.

Abstract translation: 公开了一种用于片上网络后硅修复的方法和装置。 在一个实施例中，集成电路包括片上网络的第一网络节点，其被配置为将多个功能单元中的每一个耦合到所述多个功能单元中的至少另一个功能单元。 第一网络节点包括多个端口。 多个端口中的每一个包括多个复用器，其被配置为响应于确定多个信道中的另一个是有缺陷的测试来将网络节点的备用信道替换到网络中。