公开(公告)号：US11408781B2

公开(公告)日：2022-08-09

申请号：US16441916

申请日：2019-06-14

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Ming Le ,  Yu-Chih Liang ,  Tung Yang Lee ,  Chih-Yung Tsai

IPC: A61B5/01 ,  G01K13/20 ,  A61B5/00 ,  H04R1/10

Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.