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公开(公告)号:US10303915B2
公开(公告)日:2019-05-28
申请号:US15864326
申请日:2018-01-08
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Chein-Hsun Wang , Wen-Chie Huang
Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.
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公开(公告)号:US12085451B2
公开(公告)日:2024-09-10
申请号:US17326289
申请日:2021-05-20
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Wen-Chie Huang , Yu-Chih Liang , Chein-Hsun Wang , Ming Le , Chen-Tang Huang , Chein-Hsing Yu , Tung-Yang Lee , Jenping Ku
IPC: G01J5/16 , G01J5/04 , G01J5/0806
CPC classification number: G01J5/16 , G01J5/0806 , G01J5/049
Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.
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公开(公告)号:US20220113203A1
公开(公告)日:2022-04-14
申请号:US17129074
申请日:2020-12-21
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Jenping Ku , Chein-Hsun Wang , Chein-Hsing Yu , Wen-Chang Yu
Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.
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公开(公告)号:US11918387B2
公开(公告)日:2024-03-05
申请号:US17112651
申请日:2020-12-04
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Chein-Hsun Wang , Chun-Chiang Chen , Wen-Chie Huang , Ming Le
CPC classification number: A61B5/746 , A61B5/0022 , A61B5/02055 , A61B5/1113 , A61B5/7225 , A61B5/7405 , A61B5/7455 , G08B21/0211 , G08B21/0277 , A61B5/02444 , A61B5/0816 , A61B5/0823 , A61B5/1102 , A61B2503/04 , A61B2560/0214 , A61B2560/0252 , A61B2562/0233 , A61B2562/0271
Abstract: An infant care apparatus includes a piezoelectric sensor and an infrared array sensor. The piezoelectric sensor senses a respiration rate and a heart rate of an infant. The infrared array sensor senses a body temperature and an occupancy state of the infant in a non-contact manner. The abovementioned infant care apparatus can assist in determining an abnormality of the respiration rate and the heart rate of the infant based on the occupancy state of the infant output by the infrared array sensor, so as to reduce a false alarm rate.
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公开(公告)号:US20230349768A1
公开(公告)日:2023-11-02
申请号:US18308416
申请日:2023-04-27
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Chun-Chiang Chen , Chein-Hsun Wang , Chen-Tang Huang , Jenping Ku
CPC classification number: G01J5/10 , G08B21/182 , G01J2005/106
Abstract: A temperature sensor device for a power distribution panel includes a Power over Ethernet (PoE) interface, a DC-to-DC step down converter, at least one infrared temperature sensor array, a microcontroller and a communication interface. The PoE interface is used to obtain a required power supply from the Ethernet network. The DC-to-DC step down converter steps down the power supply from a first voltage to a second voltage. The infrared temperature sensor array receives infrared rays radiated from a monitored area of the power distribution panel and generates a corresponding sensation signal. The microcontroller receives the sensation signal and generates an alert signal when the sensed temperature of the monitored area exceeds a preset threshold. The threshold can be dynamically adjusted according to time of day or day of months. The communication interface enables the communication between an external electronic device and the temperature sensor device for the power distribution panel.
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公开(公告)号:US11480471B2
公开(公告)日:2022-10-25
申请号:US17129074
申请日:2020-12-21
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Jenping Ku , Chein-Hsun Wang , Chein-Hsing Yu , Wen-Chang Yu
Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.
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公开(公告)号:US11808633B2
公开(公告)日:2023-11-07
申请号:US17403117
申请日:2021-08-16
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Chein-Hsun Wang , Da-Jun Lin , Chun-Chiang Chen , Chih-Yung Tsai , Yu-Chih Liang , Ming Le , Chen-Tang Huang , Tung-Yang Lee , Jenping Ku
Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.
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公开(公告)号:US11408781B2
公开(公告)日:2022-08-09
申请号:US16441916
申请日:2019-06-14
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Chein-Hsun Wang , Ming Le , Yu-Chih Liang , Tung Yang Lee , Chih-Yung Tsai
Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.
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公开(公告)号:US10060072B2
公开(公告)日:2018-08-28
申请号:US15483028
申请日:2017-04-10
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Chen-Tang Huang , Chein-Hsun Wang , Chein-Hsing Yu , Jenping Ku , Ming-Tsung Yang
CPC classification number: D06F58/28 , D06F58/02 , D06F58/20 , D06F58/24 , D06F2058/2819 , D06F2058/2829 , D06F2058/2841 , D06F2058/2848 , D06F2058/2854 , D06F2058/2861 , D06F2058/288 , D06F2058/289 , D06F2058/2893 , G01J5/12 , G01J2005/123
Abstract: A dryer includes a cylinder, a heater, a motor, a temperature sensor and a controller. The heater heats air and delivers the heated air into the cylinder. The motor is used to drive the cylinder to rotate. The temperature sensor includes a thermopile array sensor and a signal processor. The thermopile array sensor is used to sense an infrared light radiated from clothing and output a sensing signal. The signal processor is used to process the sensing signal to obtain at least one of a temperature distribution uniformity and an average temperature of the clothing, and output a control signal according to the at least one of the temperature distribution uniformity and the average temperature of the clothing. The controller determines to stop the drying schedule according to the control signal. The above-mentioned dryer can stop the drying schedule automatically, so as to save energy.
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公开(公告)号:US20180211081A1
公开(公告)日:2018-07-26
申请号:US15864326
申请日:2018-01-08
Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
Inventor: Chein-Hsun Wang , Wen-Chie Huang
IPC: G06K9/00
CPC classification number: G06K9/0002 , G06F21/32 , G06K9/00107
Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.
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