Ultrasonic biometric sensor
    1.
    发明授权

    公开(公告)号:US10303915B2

    公开(公告)日:2019-05-28

    申请号:US15864326

    申请日:2018-01-08

    Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.

    INFRARED TEMPERATURE SENSOR
    3.
    发明申请

    公开(公告)号:US20220113203A1

    公开(公告)日:2022-04-14

    申请号:US17129074

    申请日:2020-12-21

    Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.

    TEMPERATURE SENSOR DEVICE FOR POWER DISTRIBUTION PANEL

    公开(公告)号:US20230349768A1

    公开(公告)日:2023-11-02

    申请号:US18308416

    申请日:2023-04-27

    CPC classification number: G01J5/10 G08B21/182 G01J2005/106

    Abstract: A temperature sensor device for a power distribution panel includes a Power over Ethernet (PoE) interface, a DC-to-DC step down converter, at least one infrared temperature sensor array, a microcontroller and a communication interface. The PoE interface is used to obtain a required power supply from the Ethernet network. The DC-to-DC step down converter steps down the power supply from a first voltage to a second voltage. The infrared temperature sensor array receives infrared rays radiated from a monitored area of the power distribution panel and generates a corresponding sensation signal. The microcontroller receives the sensation signal and generates an alert signal when the sensed temperature of the monitored area exceeds a preset threshold. The threshold can be dynamically adjusted according to time of day or day of months. The communication interface enables the communication between an external electronic device and the temperature sensor device for the power distribution panel.

    Infrared temperature sensor
    6.
    发明授权

    公开(公告)号:US11480471B2

    公开(公告)日:2022-10-25

    申请号:US17129074

    申请日:2020-12-21

    Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.

    Thermal sensor package for earbuds

    公开(公告)号:US11408781B2

    公开(公告)日:2022-08-09

    申请号:US16441916

    申请日:2019-06-14

    Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.

    ULTRASONIC BIOMETRIC SENSOR
    10.
    发明申请

    公开(公告)号:US20180211081A1

    公开(公告)日:2018-07-26

    申请号:US15864326

    申请日:2018-01-08

    CPC classification number: G06K9/0002 G06F21/32 G06K9/00107

    Abstract: An ultrasonic biometric sensor comprises a detection chip. The detection chip includes a substrate, an ultrasonic transducer array and a control circuit. The ultrasonic transducer array is arranged on the substrate, including a plurality of arrayed piezoelectric elements. Each piezoelectric element is disposed on a floating membrane. The floating membrane is suspended in the opening side of a cavity by at least one support arm extending transversely. The control circuit is also arranged on the substrate and electrically connected with each piezoelectric element through the support arm to control the ultrasonic transducer array to generate an ultrasonic signal and read the reflected ultrasonic signal received by the ultrasonic transducer array. The ultrasonic biometric sensor is easy to fabricate and has a high yield.

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