公开(公告)号：US11918387B2

公开(公告)日：2024-03-05

申请号：US17112651

申请日：2020-12-04

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Chun-Chiang Chen ,  Wen-Chie Huang ,  Ming Le

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/11 ,  G08B21/02 ,  A61B5/024 ,  A61B5/08

CPC classification number: A61B5/746 ,  A61B5/0022 ,  A61B5/02055 ,  A61B5/1113 ,  A61B5/7225 ,  A61B5/7405 ,  A61B5/7455 ,  G08B21/0211 ,  G08B21/0277 ,  A61B5/02444 ,  A61B5/0816 ,  A61B5/0823 ,  A61B5/1102 ,  A61B2503/04 ,  A61B2560/0214 ,  A61B2560/0252 ,  A61B2562/0233 ,  A61B2562/0271

Abstract: An infant care apparatus includes a piezoelectric sensor and an infrared array sensor. The piezoelectric sensor senses a respiration rate and a heart rate of an infant. The infrared array sensor senses a body temperature and an occupancy state of the infant in a non-contact manner. The abovementioned infant care apparatus can assist in determining an abnormality of the respiration rate and the heart rate of the infant based on the occupancy state of the infant output by the infrared array sensor, so as to reduce a false alarm rate.

公开(公告)号：US12085451B2

公开(公告)日：2024-09-10

申请号：US17326289

申请日：2021-05-20

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Wen-Chie Huang ,  Yu-Chih Liang ,  Chein-Hsun Wang ,  Ming Le ,  Chen-Tang Huang ,  Chein-Hsing Yu ,  Tung-Yang Lee ,  Jenping Ku

IPC: G01J5/16 ,  G01J5/04 ,  G01J5/0806

CPC classification number: G01J5/16 ,  G01J5/0806 ,  G01J5/049

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

公开(公告)号：US11808633B2

公开(公告)日：2023-11-07

申请号：US17403117

申请日：2021-08-16

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Da-Jun Lin ,  Chun-Chiang Chen ,  Chih-Yung Tsai ,  Yu-Chih Liang ,  Ming Le ,  Chen-Tang Huang ,  Tung-Yang Lee ,  Jenping Ku

IPC: G01J5/00 ,  G01J5/14 ,  G01J5/02 ,  G01K7/06 ,  G01K7/02 ,  G01J5/04 ,  H10N10/817

CPC classification number: G01J5/14 ,  G01J5/025 ,  G01J5/045 ,  G01K7/028 ,  G01K7/06 ,  H10N10/817

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

公开(公告)号：US11408781B2

公开(公告)日：2022-08-09

申请号：US16441916

申请日：2019-06-14

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Ming Le ,  Yu-Chih Liang ,  Tung Yang Lee ,  Chih-Yung Tsai

IPC: A61B5/01 ,  G01K13/20 ,  A61B5/00 ,  H04R1/10

Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.