公开(公告)号：US12257631B2

公开(公告)日：2025-03-25

申请号：US17250764

申请日：2019-09-02

Applicant: OSAKA SODA CO., LTD.

Inventor： Takamichi Mori ,  Junichiro Minami ,  Naruhito Iwasa ,  Masatoshi Okuda

IPC: C09J9/02 ,  B22F1/05 ,  B22F1/0545 ,  B22F1/07 ,  B22F1/102 ,  B22F1/148 ,  B22F7/08 ,  C09J11/04 ,  B22F1/054

Abstract: The present invention provides silver nanoparticles that form a sintered body having a high shear strength and a low specific resistance when sintered at a low temperature (for example, 200° C. or less), even though the silver nanoparticles have an average particle diameter as large as 200 nm or more. Silver nanoparticles having an average particle diameter of 200 to 600 nm, wherein an exothermic peak due to binding of the silver nanoparticles in thermogravimetry-differential thermal analysis appears at less than 175° C., and a weight loss on heating from 30 to 500° C. by thermogravimetry-differential thermal analysis is 0.4% by weight or less.

公开(公告)号：US20220288678A1

公开(公告)日：2022-09-15

申请号：US17638709

申请日：2020-08-12

Applicant: Osaka Soda Co., Ltd.

Inventor： Masatoshi Okuda ,  Takamichi Mori ,  Junichiro Minami ,  Naruhito Iwasa

IPC: B22F1/054 ,  C09J9/02 ,  B22F3/10

Abstract: The present invention provides novel silver particles that when used as a conductive adhesive, are satisfactorily sintered at a low temperature without application of pressure during sintering of the conductive adhesive, and form a sintered body with high denseness and high mechanical strength (shear strength). Silver particles comprising silver particles A with an average particle diameter in the range of 50 to 500 nm, and silver particles B with an average particle diameter in the range of 0.5 to 5.5 μm, wherein the silver particles satisfy a relationship in which the average particle diameter of the silver particles B is 5 to 11 times the average particle diameter of the silver particles A.