Cooling device for cooling by means of a cooling fluid

    公开(公告)号:US12185503B2

    公开(公告)日:2024-12-31

    申请号:US17894976

    申请日:2022-08-24

    Applicant: OSRAM GmbH

    Abstract: Disclosed herein is a cooling device, comprising a cooling plate and a cooling cap, for cooling a heat source, mounted to an outer interface surface of the cooling plate, by means of a cooling fluid. Several spiral-shaped fins are integrated into the cooling plate to form a structure in the shape of a multi-spiral. The fins are arranged next to each other in a mutual distance to form spiral-shaped flow channels for a cooling fluid. An inlet for inflowing the cooling fluid at the center of the multi-spiral fins structure is integrated into the cooling cap. The cooling cap is configured and arranged on the cooling plate so that the inlet is positioned above the center of the multi-spiral fins structure.

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