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公开(公告)号:US10024528B2
公开(公告)日:2018-07-17
申请号:US14906570
申请日:2014-07-21
Applicant: OSRAM GmbH
Inventor: Rencheng Li , Tingbiao Lan , Ran Lin , Zhian Li
IPC: F21V29/71 , F21V17/00 , F21V17/12 , F21V23/00 , F21V29/507 , F21V29/89 , F21K9/238 , F21Y105/10 , F21K9/233 , F21Y115/10
Abstract: Various embodiments may relate to an illuminating device including a light engine, a housing and a driver contained in the housing, wherein the illuminating device further includes a heat dissipation device disposed in the housing which includes a substrate for supporting the light engine and an insert ring in thermal-conductive contact with the substrate.
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公开(公告)号:US20160169499A1
公开(公告)日:2016-06-16
申请号:US14906570
申请日:2014-07-21
Applicant: OSRAM GmbH
Inventor: Rencheng Li , Tingbiao Lan , Ran Lin , Zhian Li
CPC classification number: F21V29/713 , F21K9/233 , F21K9/238 , F21V17/005 , F21V17/12 , F21V23/006 , F21V29/507 , F21V29/89 , F21Y2105/10 , F21Y2115/10
Abstract: Various embodiments may relate to an illuminating device including a light engine, a housing and a driver contained in the housing, wherein the illuminating device further includes a heat dissipation device disposed in the housing which includes a substrate for supporting the light engine and an insert ring in thermal-conductive contact with the substrate.
Abstract translation: 各种实施例可涉及包括光引擎,壳体和容纳在壳体中的驱动器的照明装置,其中照明装置还包括设置在壳体中的散热装置,该散热装置包括用于支撑光引擎的基板和插入环 与基板导热接触。
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