公开(公告)号：US10571109B2

公开(公告)日：2020-02-25

申请号：US14402111

申请日：2013-05-23

Applicant: OSRAM GmbH

Inventor： Yaojun Feng ,  Yuanyuan He ,  Hua Wang ,  Zhian Li

IPC: F21V29/508 ,  F21V23/00 ,  F21V5/04 ,  F21V29/83 ,  F21Y105/10 ,  F21Y115/10

Abstract: Various embodiments may relate to an illuminating device. The illuminating device includes a base having a partition board dividing the base into a first accommodating cavity and a second accommodating cavity, a circuit board having light sources and arranged in the first accommodating cavity, and an optical assembly arranged at an opening end of the first accommodating cavity. The partition board, the circuit board and the optical assembly each have at least one air communication structure to enable air from environment to flow into the first accommodating cavity and the second accommodating cavity.

公开(公告)号：US20160169499A1

公开(公告)日：2016-06-16

申请号：US14906570

申请日：2014-07-21

Applicant: OSRAM GmbH

Inventor： Rencheng Li ,  Tingbiao Lan ,  Ran Lin ,  Zhian Li

IPC: F21V29/71 ,  F21V23/00 ,  F21V17/00 ,  F21V17/12 ,  F21V29/507 ,  F21V29/89

CPC classification number: F21V29/713 ,  F21K9/233 ,  F21K9/238 ,  F21V17/005 ,  F21V17/12 ,  F21V23/006 ,  F21V29/507 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: Various embodiments may relate to an illuminating device including a light engine, a housing and a driver contained in the housing, wherein the illuminating device further includes a heat dissipation device disposed in the housing which includes a substrate for supporting the light engine and an insert ring in thermal-conductive contact with the substrate.

Abstract translation: 各种实施例可涉及包括光引擎，壳体和容纳在壳体中的驱动器的照明装置，其中照明装置还包括设置在壳体中的散热装置，该散热装置包括用于支撑光引擎的基板和插入环 与基板导热接触。

公开(公告)号：US10024528B2

公开(公告)日：2018-07-17

申请号：US14906570

申请日：2014-07-21

Applicant: OSRAM GmbH

Inventor： Rencheng Li ,  Tingbiao Lan ,  Ran Lin ,  Zhian Li

IPC: F21V29/71 ,  F21V17/00 ,  F21V17/12 ,  F21V23/00 ,  F21V29/507 ,  F21V29/89 ,  F21K9/238 ,  F21Y105/10 ,  F21K9/233 ,  F21Y115/10

Abstract: Various embodiments may relate to an illuminating device including a light engine, a housing and a driver contained in the housing, wherein the illuminating device further includes a heat dissipation device disposed in the housing which includes a substrate for supporting the light engine and an insert ring in thermal-conductive contact with the substrate.

公开(公告)号：US20150109777A1

公开(公告)日：2015-04-23

申请号：US14402111

申请日：2013-05-23

Applicant: OSRAM GmbH

Inventor： Yaojun Feng ,  Yuanyuan He ,  Hua Wang ,  Zhian Li

IPC: F21V29/00 ,  F21V29/508 ,  F21V5/04 ,  F21V23/00

Abstract: Various embodiments may relate to an illuminating device. The illuminating device includes a base having a partition board dividing the base into a first accommodating cavity and a second accommodating cavity, a circuit board having light sources and arranged in the first accommodating cavity, and an optical assembly arranged at an opening end of the first accommodating cavity. The partition board, the circuit board and the optical assembly each have at least one air communication structure to enable air from environment to flow into the first accommodating cavity and the second accommodating cavity.

Abstract translation: 各种实施例可以涉及照明装置。 该照明装置包括具有将基座分隔为第一容纳腔和第二容纳腔的隔板，具有光源并布置在第一容纳腔中的电路板，以及布置在第一容纳腔的开口端的光学组件 容纳腔。 分隔板，电路板和光学组件各自具有至少一个空气连通结构，以使来自环境的空气流入第一容纳腔和第二容纳腔。