公开(公告)号：US12206044B2

公开(公告)日：2025-01-21

申请号：US17264320

申请日：2019-07-31

Applicant: OSRAM OLED GMBH

Inventor： André Steiner ,  Christine Rafael ,  Paola Altieri-Weimar

IPC: H01L33/12 ,  H01L33/62 ,  H01S5/22 ,  H01S5/32

Abstract: A semiconductor device may include a conductive layer over a semiconductor body and a first stress compensation layer adjacent to the conductive layer. The stress compensation layer may include a defined first stress.

公开(公告)号：US20210328103A1

公开(公告)日：2021-10-21

申请号：US17264320

申请日：2019-07-31

Applicant: OSRAM OLED GMBH

Inventor： André Steiner ,  Christine RAFAEL ,  Paola Altieri-Weimar

IPC: H01L33/12 ,  H01S5/32 ,  H01S5/22 ,  H01L33/62

Abstract: A semiconductor device may include a conductive layer over a semiconductor body and a first stress compensation layer adjacent to the conductive layer. The stress compensation layer may include a defined first stress.