公开(公告)号：US20210126163A1

公开(公告)日：2021-04-29

申请号：US16644962

申请日：2018-09-03

Applicant: OSRAM OLED GmbH

Inventor： Michael Huber ,  Jana Sommerfeld ,  Martin Herz ,  Sebastian Hoibl ,  Christian Rumbolz ,  Albrecht Kieslich ,  Bernd Boehm ,  Georg Rossbach ,  Markus Broell

IPC: H01L33/24 ,  H01L33/00

Abstract: The invention relates to a method for producing an optoelectronic semiconductor chip comprising the following steps: providing a semiconductor body (1) having a radiation-permeable surface (1a), and introducing structures (2) into the semiconductor body (1) on the radiation-permeable surface (1a), wherein the structures (2) are quasi-regular.

公开(公告)号：US11476389B2

公开(公告)日：2022-10-18

申请号：US16644962

申请日：2018-09-03

Applicant: OSRAM OLED GmbH

Inventor： Michael Huber ,  Jana Sommerfeld ,  Martin Herz ,  Sebastian Hoibl ,  Christian Rumbolz ,  Albrecht Kieslich ,  Bernd Boehm ,  Georg Rossbach ,  Markus Broell

IPC: H01L33/24 ,  H01L33/00

Abstract: The invention relates to a method for producing an optoelectronic semiconductor chip comprising the following steps: providing a semiconductor body (1) having a radiation-permeable surface (1a), and introducing structures (2) into the semiconductor body (1) on the radiation-permeable surface (1a), wherein the structures (2) are quasi-regular.