公开(公告)号：US11476389B2

公开(公告)日：2022-10-18

申请号：US16644962

申请日：2018-09-03

Applicant: OSRAM OLED GmbH

Inventor： Michael Huber ,  Jana Sommerfeld ,  Martin Herz ,  Sebastian Hoibl ,  Christian Rumbolz ,  Albrecht Kieslich ,  Bernd Boehm ,  Georg Rossbach ,  Markus Broell

IPC: H01L33/24 ,  H01L33/00

Abstract: The invention relates to a method for producing an optoelectronic semiconductor chip comprising the following steps: providing a semiconductor body (1) having a radiation-permeable surface (1a), and introducing structures (2) into the semiconductor body (1) on the radiation-permeable surface (1a), wherein the structures (2) are quasi-regular.

公开(公告)号：US20210223559A1

公开(公告)日：2021-07-22

申请号：US17219943

申请日：2021-04-01

Applicant: OSRAM OLED GmbH

Inventor： Roland Enzmann ,  Hubert Halbritter ,  Markus Arzberger ,  Andreas Ploessl ,  Roland Schulz ,  Georg Rossbach ,  Bernd Boehm ,  Frank Singer ,  Matthias Sabathil

IPC: G02B27/09 ,  G02B5/18 ,  G02B3/00

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.

公开(公告)号：US11892651B2

公开(公告)日：2024-02-06

申请号：US17219943

申请日：2021-04-01

Applicant: OSRAM OLED GmbH

Inventor： Roland Enzmann ,  Hubert Halbritter ,  Markus Arzberger ,  Andreas Ploessl ,  Roland Schulz ,  Georg Rossbach ,  Bernd Boehm ,  Frank Singer ,  Matthias Sabathil

IPC: G02B27/09 ,  G02B5/18 ,  G02B3/00

CPC classification number: G02B27/0916 ,  G02B3/0075 ,  G02B5/1814 ,  G02B5/1857 ,  G02B5/1866 ,  G02B27/0944 ,  G02B27/0961

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.

公开(公告)号：US20210126163A1

公开(公告)日：2021-04-29

申请号：US16644962

申请日：2018-09-03

Applicant: OSRAM OLED GmbH

Inventor： Michael Huber ,  Jana Sommerfeld ,  Martin Herz ,  Sebastian Hoibl ,  Christian Rumbolz ,  Albrecht Kieslich ,  Bernd Boehm ,  Georg Rossbach ,  Markus Broell

IPC: H01L33/24 ,  H01L33/00

Abstract: The invention relates to a method for producing an optoelectronic semiconductor chip comprising the following steps: providing a semiconductor body (1) having a radiation-permeable surface (1a), and introducing structures (2) into the semiconductor body (1) on the radiation-permeable surface (1a), wherein the structures (2) are quasi-regular.