公开(公告)号：US20210223559A1

公开(公告)日：2021-07-22

申请号：US17219943

申请日：2021-04-01

Applicant: OSRAM OLED GmbH

Inventor： Roland Enzmann ,  Hubert Halbritter ,  Markus Arzberger ,  Andreas Ploessl ,  Roland Schulz ,  Georg Rossbach ,  Bernd Boehm ,  Frank Singer ,  Matthias Sabathil

IPC: G02B27/09 ,  G02B5/18 ,  G02B3/00

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.

公开(公告)号：US10673202B2

公开(公告)日：2020-06-02

申请号：US16112615

申请日：2018-08-24

Applicant: OSRAM OLED GMBH

Inventor： Georg Rossbach ,  Hubert Halbritter

IPC: H01S5/00 ,  H01S5/42 ,  H01S5/183 ,  G02B27/42 ,  H01S5/022

Abstract: A laser component is provided which comprises: a surface emitting semiconductor laser configured to emit electromagnetic radiation along an emission axis, an optical element disposed downstream of the semiconductor laser along the emission axis, wherein the optical element comprises a diffractive structure, and a further optical element configured to cause radiation to be emitted asymmetrically with respect to the emission axis. Furthermore, the use of a laser component, a device having a laser component and a method for the production of laser components are provided.

公开(公告)号：US11476389B2

公开(公告)日：2022-10-18

申请号：US16644962

申请日：2018-09-03

Applicant: OSRAM OLED GmbH

Inventor： Michael Huber ,  Jana Sommerfeld ,  Martin Herz ,  Sebastian Hoibl ,  Christian Rumbolz ,  Albrecht Kieslich ,  Bernd Boehm ,  Georg Rossbach ,  Markus Broell

IPC: H01L33/24 ,  H01L33/00

Abstract: The invention relates to a method for producing an optoelectronic semiconductor chip comprising the following steps: providing a semiconductor body (1) having a radiation-permeable surface (1a), and introducing structures (2) into the semiconductor body (1) on the radiation-permeable surface (1a), wherein the structures (2) are quasi-regular.

公开(公告)号：US11892651B2

公开(公告)日：2024-02-06

申请号：US17219943

申请日：2021-04-01

Applicant: OSRAM OLED GmbH

Inventor： Roland Enzmann ,  Hubert Halbritter ,  Markus Arzberger ,  Andreas Ploessl ,  Roland Schulz ,  Georg Rossbach ,  Bernd Boehm ,  Frank Singer ,  Matthias Sabathil

IPC: G02B27/09 ,  G02B5/18 ,  G02B3/00

CPC classification number: G02B27/0916 ,  G02B3/0075 ,  G02B5/1814 ,  G02B5/1857 ,  G02B5/1866 ,  G02B27/0944 ,  G02B27/0961

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip configured to emit electromagnetic radiation; an optically effective element arranged such that electromagnetic radiation emitted by the optoelectronic semiconductor chip passes through the optically effective element; and a housing, wherein the optoelectronic semiconductor chip is arranged in a cavity of the housing, the optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure.

公开(公告)号：US20210126163A1

公开(公告)日：2021-04-29

申请号：US16644962

申请日：2018-09-03

Applicant: OSRAM OLED GmbH

Inventor： Michael Huber ,  Jana Sommerfeld ,  Martin Herz ,  Sebastian Hoibl ,  Christian Rumbolz ,  Albrecht Kieslich ,  Bernd Boehm ,  Georg Rossbach ,  Markus Broell

IPC: H01L33/24 ,  H01L33/00

Abstract: The invention relates to a method for producing an optoelectronic semiconductor chip comprising the following steps: providing a semiconductor body (1) having a radiation-permeable surface (1a), and introducing structures (2) into the semiconductor body (1) on the radiation-permeable surface (1a), wherein the structures (2) are quasi-regular.