公开(公告)号：US11444224B2

公开(公告)日：2022-09-13

申请号：US16964608

申请日：2019-01-25

Applicant: Osram OLED GmbH

Inventor： Ulrich Streppel ,  Hailing Cui ,  Desiree Queren ,  Dajana Durach

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60

Abstract: A light-emitting semiconductor component may include a conversion layer, a radiation surface, and a plurality of adjacently arranged emission regions configured to be operated separately, individually and/or in groups. The conversion layer may be arranged downstream of the emission regions in the direction of radiation of the emission regions. The emission regions may be configured to emit primary radiation of a first wavelength range into the conversion layer. The conversion layer may be configured to convert at least a portion of the primary radiation into secondary radiation of a second wavelength range. Mixed radiation is configured to be emitted from the light-emitting semiconductor component at the radiation surface. The mixed radiation may include primary radiation and secondary radiation. A probability that primary radiation travelling from the emission region to the radiation surface is converted into secondary radiation may vary along the radiation surface by a maximum factor of 2.

公开(公告)号：US20200295236A1

公开(公告)日：2020-09-17

申请号：US16642846

申请日：2018-08-28

Applicant: OSRAM OLED GmbH

Inventor： Markus Pindl ,  Hailing Cui

IPC: H01L33/50 ,  H01L33/56

Abstract: A method for manufacturing an optoelectronic semiconductor device and an optoelectronic semiconductor device are disclosed. In an embodiment a method includes applying a photostructurable first photo layer on the radiation side of a semiconductor layer sequence, photostructuring the first photo layer, wherein holes are formed in the first photo layer in regions of first illumination areas, applying a first converter material to the structured first photo layer, wherein the first converter material partially or completely fills the holes, thereby forming first converter elements in the holes, the first converter elements covering the associated first illumination areas, removing the first photo layer; and applying a second converter material to the radiation side at least in regions of second illumination areas, the second illumination areas being different from the first illumination areas.