公开(公告)号：US11837844B2

公开(公告)日：2023-12-05

申请号：US16961901

申请日：2018-12-27

Applicant: OSRAM OLED GmbH

Inventor： John Brückner ,  Urs Heine ,  Sven Gerhard ,  Lars Nähle ,  Andreas Löffler ,  André Somers

IPC: H01S5/02 ,  H01L21/304 ,  H01L21/302

CPC classification number: H01S5/0203 ,  H01S5/0206 ,  H01L21/302 ,  H01L21/304

Abstract: A method for singulating semiconductor components (20) is specified, said method comprising the steps of providing a carrier (21), applying at least two semiconductor chips (22) on the carrier (21), etching at least one break nucleus (23) at a side of the carrier (21) facing the semiconductor chips (22), and singulating at least two semiconductor components (20) by breaking the carrier (21) along the at least one break nucleus (23). The at least one break nucleus (23) extends at least in places in a vertical direction (z), the vertical direction (z) being perpendicular to a main extension plane of the carrier (21), and the at least one break nucleus (23) is arranged between the two semiconductor chips (22) in a lateral direction (x), the lateral direction (x) being parallel to the main extension plane of the carrier (21). Further, each of the semiconductor components (20) comprises at least one of the semiconductor chips (22), and the expansion of the at least one break nucleus (23) in the vertical direction (z) is at least 1% of the expansion of the carrier (21) in the vertical direction (z). Furthermore, a semiconductor component (20) is specified.