公开(公告)号：US20200225740A1

公开(公告)日：2020-07-16

申请号：US16647193

申请日：2018-09-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Daniel Dietze ,  Maximilian Assig ,  Claus Jaeger

IPC: G06F3/01 ,  G01S1/70 ,  G01S3/789 ,  G06T19/00

Abstract: A sensor and a 3-D position detection system are disclosed. In an embodiment a sensor includes at least one sensor chip configured to detect radiation, at least one carrier on which the sensor chip is mounted and a cast body that is transmissive for the radiation and that completely covers the sensor chip, wherein a centroid shift of the sensor chip amounts to at most 0.04 mrad at an angle of incidence of up to at least 60°, wherein the cast body comprises a light inlet side that faces away from the sensor chip, and the light inlet side comprises side walls bounding it on all sides, wherein the side walls are smooth, planar and transmissive for the radiation, wherein a free field-of-view on the light inlet side has an aperture angle of at least 140°, and wherein the cast body protrudes in a direction away from the sensor chip beyond a bond wire.