公开(公告)号：US20230006118A1

公开(公告)日：2023-01-05

申请号：US17782545

申请日：2020-11-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Hermann Nuss ,  Andreas Dobner ,  Bjoern Hoxhold ,  Andreas Waldschik ,  Erwin Beer ,  Bernd Boehm ,  Ludwig Hofbauer ,  Stefan Merl ,  Stefan Rass ,  Matthias Stark

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/00

Abstract: In an embodiment an optoelectronic device includes a carrier and a plurality of semiconductor chips fastened on the carrier by a connector, wherein each semiconductor chip has at least one contact pad on a main surface facing away from the carrier, wherein each contact pad is contacted electrically by an interconnecting track, and wherein the interconnecting track is guided over an edge of the main surface of the semiconductor chip onto the carrier.