公开(公告)号：US20230006118A1

公开(公告)日：2023-01-05

申请号：US17782545

申请日：2020-11-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Hermann Nuss ,  Andreas Dobner ,  Bjoern Hoxhold ,  Andreas Waldschik ,  Erwin Beer ,  Bernd Boehm ,  Ludwig Hofbauer ,  Stefan Merl ,  Stefan Rass ,  Matthias Stark

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/00

Abstract: In an embodiment an optoelectronic device includes a carrier and a plurality of semiconductor chips fastened on the carrier by a connector, wherein each semiconductor chip has at least one contact pad on a main surface facing away from the carrier, wherein each contact pad is contacted electrically by an interconnecting track, and wherein the interconnecting track is guided over an edge of the main surface of the semiconductor chip onto the carrier.

公开(公告)号：US20230015476A1

公开(公告)日：2023-01-19

申请号：US17757726

申请日：2020-12-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Rass ,  Bjoern Hoxhold ,  Andreas Waldschik ,  Andreas Dobner ,  Hermann Nuss

IPC: H01L33/62 ,  H01L25/075

Abstract: In an embodiment a semiconductor component includes a carrier, at least one semiconductor chip arranged on the carrier, the semiconductor chip having at least one first electrical contact at a main surface of the semiconductor chip facing away from the carrier, an electrically insulating layer arranged on the carrier and at least one electrical connection layer led by the electrically insulating layer to the first electrical contact, wherein the electrically insulating layer includes a photopatternable material.