公开(公告)号：US11413834B2

公开(公告)日：2022-08-16

申请号：US16318879

申请日：2017-07-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Marco Wittmann ,  Markus Boss

IPC: B29D11/00

Abstract: A method of producing optical components includes providing an initial carrier including cutouts; carrying out a molding process to form transparent optical molded parts arranged in the cutouts of the initial carrier, wherein a molding compound is introduced into the cutouts of the initial carrier and the molding compound is molded and cured; and singulating the initial carrier including the optical molded parts so that separate optical components are formed that respectively include a carrier produced from the initial carrier and including a cutout, and an optical molded part arranged in the cutout.

公开(公告)号：US20190184655A1

公开(公告)日：2019-06-20

申请号：US16318879

申请日：2017-07-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Marco Wittmann ,  Markus Boss

IPC: B29D11/00

CPC classification number: B29D11/00375 ,  B29D11/00269 ,  B29D11/00413 ,  B29D11/0048

Abstract: A method of producing optical components includes providing an initial carrier including cutouts; carrying out a molding process to form transparent optical molded parts arranged in the cutouts of the initial carrier, wherein a molding compound is introduced into the cutouts of the initial carrier and the molding compound is molded and cured; and singulating the initial carrier including the optical molded parts so that separate optical components are formed that respectively include a carrier produced from the initial carrier and including a cutout, and an optical molded part arranged in the cutout.