公开(公告)号：US10236428B2

公开(公告)日：2019-03-19

申请号：US15541464

申请日：2015-12-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Weng Chung Tan ,  Rodello Cadiz Sigalat ,  Hussen Mohd Hanifah ,  Tobias Gebuhr

IPC: H01L33/62 ,  H01L25/075

Abstract: A lead frame is disclosed. In an embodiment, the lead frame includes a frame having a plurality of lead frame sections, wherein the lead frame sections are connected to the frame, wherein the frame has at least two longitudinal sides and at least two transverse sides, wherein at least in one longitudinal side includes an imprint, and wherein the imprint bolsters stability of the longitudinal side against sagging.

公开(公告)号：US20170373233A1

公开(公告)日：2017-12-28

申请号：US15541464

申请日：2015-12-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Weng Chung Tan ,  Rodello Cadiz Sigalat ,  Hussen Mohd Hanifah ,  Tobias Gebuhr

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/075 ,  H01L25/0753 ,  H01L2224/42 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame is disclosed. In an embodiment, the lead frame includes a frame having a plurality of lead frame sections, wherein the lead frame sections are connected to the frame, wherein the frame has at least two longitudinal sides and at least two transverse sides, wherein at least in one longitudinal side includes an imprint, and wherein the imprint bolsters stability of the longitudinal side against sagging.