公开(公告)号：US11931185B2

公开(公告)日：2024-03-19

申请号：US17440657

申请日：2020-03-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sergey Kudaev ,  Reiner Windisch ,  Dennis Sprenger ,  Ralph Wirth ,  Thomas Klafta

IPC: A61B5/00 ,  A61B5/024

CPC classification number: A61B5/7207 ,  A61B5/02427 ,  A61B5/6801 ,  A61B2562/12

Abstract: In an embodiment a vital sign sensor includes an emitter component configured to emit light, a detector component configured to detect light, a first layer of a substantially transparent material, wherein the emitter component is embedded in the first layer, and a second layer of a light scattering material arranged on the first layer, wherein the second layer includes converter particles, and wherein the first layer and the second layer are surrounded by at least one wall of a reflective material.

公开(公告)号：US20220151564A1

公开(公告)日：2022-05-19

申请号：US17440657

申请日：2020-03-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sergey Kudaev ,  Reiner Windisch ,  Dennis Sprenger ,  Ralph Wirth ,  Thomas Klafta

IPC: A61B5/00 ,  A61B5/024

Abstract: In an embodiment a vital sign sensor includes an emitter component configured to emit light, a detector component configured to detect light, a first layer of a substantially transparent material, wherein the emitter component is embedded in the first layer, and a second layer of a light scattering material arranged on the first layer, wherein the second layer includes converter particles, and wherein the first layer and the second layer are surrounded by at least one wall of a reflective material.

公开(公告)号：US11201141B2

公开(公告)日：2021-12-14

申请号：US16317536

申请日：2017-09-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sergey Kudaev ,  Krister Bergenek

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  F21K9/232 ,  H01L33/58 ,  H01L33/32 ,  H01L33/36

Abstract: A light emitting device is disclosed. In an embodiment a light-emitting device includes a plurality of light-emitting diode chips arranged on a mounting surface of a carrier, a first translucent element and a second translucent element, wherein the first translucent element is arranged over the plurality of light-emitting diode chips as viewed from the mounting surface and the second translucent element is disposed on a side of the plurality of light-emitting diode chips opposite the first translucent element such that the light-emitting diode chips are arranged between the first and second translucent elements, wherein the first and second translucent elements are configured to emit light generated by the light-emitting diode chips during operation outwardly, and wherein the first and second translucent elements appear white or grey in daylight.

公开(公告)号：US20200096160A1

公开(公告)日：2020-03-26

申请号：US16495813

申请日：2018-03-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sergey Kudaev ,  Farhang Ghasemi Afshar ,  Jörg Erich Sorg ,  Andreas Dobner

IPC: F21K9/232 ,  F21K9/90

Abstract: A filament structure, a lighting device with filament structures, a method for manufacturing a lighting device and a method for manufacturing a filament structure are disclosed. In an embodiment, a filament structure includes at least two filament elements, each of the at least two filament elements comprising a leadframe element having a first end region and a second end region and a plurality of light-emitting diodes arranged on the leadframe element, at least one connecting element connecting the first end region of one of the at least two filament elements to the first end region of another of the at least two filament elements so that the at least two filament elements are connected in series and at least one further filament element including a leadframe element comprising a first end region and a second end region and a plurality of light-emitting diodes, wherein the leadframe element of the further filament element is a part of an one-piece leadframe, wherein the first end region of the leadframe element of the further filament element is connected via the connecting element to the first end regions of the at least two filament elements and wherein the connecting element is shaped and/or bendable such that each of the filament elements of the filament structure extends along a lateral surface of an imaginary cone or pyramid.