公开(公告)号：US20180206303A1

公开(公告)日：2018-07-19

申请号：US15863766

申请日：2018-01-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ulrich STREPPEL ,  Siegfried HERRMANN

IPC: H05B33/08

CPC classification number: H05B33/0827 ,  G02B27/0955 ,  G02B27/0977 ,  H01L25/0756 ,  H01L33/10 ,  H01L2933/0033 ,  H05B33/0842 ,  H05B33/0845

Abstract: In one embodiment, the lighting device (1) comprises at least one base chip (21) and a plurality of cover emitter regions (22). The base chip or chips (21) and the cover emitter regions (22) are realized by light-emitting diode chips and can be electrically controlled independently of one another. Main emission directions (M) of these light-emitting diode chips are oriented parallel to one another. The cover emitter regions (22) are partially overlapping with the at least one base chip (21), so that an overlap region (3, B) is formed and the at least one base chip (21) radiates through the cover emitter regions (22) during operation. The cover emitter regions (22) are arranged in a common plane perpendicular to the main emission directions (M).

公开(公告)号：US20240045265A1

公开(公告)日：2024-02-08

申请号：US17641368

申请日：2020-11-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ulrich STREPPEL

IPC: G02F1/13357 ,  G02F1/1335

CPC classification number: G02F1/133605 ,  G02F1/133603 ,  G02F1/133607

Abstract: The present invention relates to an LED backlighting system comprising a substrate, an optoelectronic semiconductor chip assembly, a reflector and a diffuser element. The optoelectronic semiconductor chip assembly is disposed on an upper side of the substrate. The reflector has a through-hole that extends between a lower opening on an underside of the reflector and an upper opening on an upper side of the reflector. The reflector is disposed on the upper side of the substrate so that the underside of the reflector is facing the upper side of the substrate. The optoelectronic semiconductor chip assembly is disposed in the through-hole of the reflector. The diffuser element has an upper side and an underside. The diffuser element is disposed above the upper side of the reflector so that the underside of the diffuser element is facing the upper side of the reflector.

公开(公告)号：US20240280857A1

公开(公告)日：2024-08-22

申请号：US18563693

申请日：2022-05-24

Applicant: OSRAM Opto Semiconductors Gmbh

Inventor： Ulrich STREPPEL

IPC: G02F1/1335 ,  G02F1/13357

CPC classification number: G02F1/133607 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133608

Abstract: A backlighting unit comprises a carrier having a top side arranged parallel to an x-y-plane, a reflector assemblage arranged over the carrier in a z-direction, an optical assemblage arranged over the reflector assemblage in the z-direction, and a diffuser arranged over the optical assemblage in the z-direction. A cell of the backlighting unit comprises a section of the carrier having an optoelectronic semiconductor chip arranged on the top side, a reflector of the reflector assemblage, an optical element of the optical assemblage, and a section of the diffuser. The reflector has a concave mirror surface. The optical element has a front side facing the reflector and a rear side facing away from the reflector. The front side is subdivided into front-side surface sections arranged in a matrix-type fashion. The rear side is subdivided into rear-side surface sections arranged in a matrix-type fashion.

公开(公告)号：US20220310893A1

公开(公告)日：2022-09-29

申请号：US17615764

申请日：2020-10-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ulrich FREI ,  Ludwig HOFBAUER ,  Michael BRANDL ,  Rainer HUBER ,  Sebastian WITTMANN ,  Peter BRICK ,  Ulrich STREPPEL

IPC: H01L33/62 ,  H05B45/18

Abstract: Optoelectronic arrangement is proposed for use in a transparent glazing element of a vehicle, for example. The arrangement comprises at least one substantially transparent carrier layer, at least one conductor layer comprising conductor paths provided on at least one side of said carrier layer, at least one light emitting element arranged on the carrier layer and electrically coupled to conductor paths on said conductor layer and at least one proximity and/or touch sensor arranged on at least one of said carrier layers, the arrangement further being couplable to a control module for controlling the operation of said at least one light emitting element in response to information from said at least one proximity and/or touch sensor.