公开(公告)号：US20040137173A1

公开(公告)日：2004-07-15

申请号：US10342854

申请日：2003-01-15

Applicant: OSRAM SYLVANIA INC.

Inventor： John H. Selverian ,  H. Steven Mackel ,  William D. Koenigsberg

IPC: B32B001/02

CPC classification number: C08L95/00 ,  C08K3/36 ,  H01F27/022 ,  H01F38/10 ,  H05K3/284 ,  H05K5/064 ,  Y10T29/49146 ,  Y10T428/13 ,  Y10T428/239 ,  C08L2666/72

Abstract: A potting compound for electronic components comprises a first composition of asphalt and sand and a second composition that attenuates the forces normally applied by the first composition when it is used alone. The force attenuator preferably comprises solvent-refined heavy paraffinic petroleum oil from about 0.1 to 20 wt % of the compound.

Abstract translation: 用于电子部件的灌封化合物包括沥青和沙子的第一组合物和当单独使用时能够衰减通常由第一组合物施加的力的第二组合物。 力衰减器优选包含约0.1至20重量％的化合物的溶剂精制重链烷烃石油油。