公开(公告)号：US3681261A

公开(公告)日：1972-08-01

申请号：US3681261D

申请日：1970-07-27

Applicant: OWENS ILLINOIS INC

Inventor： MASON DANIEL W ,  GREENSTEIN BERNARD ,  WOULBROUN JOHN M

IPC: H01C17/065 ,  B44D1/02 ,  H01B1/06

CPC classification number: H01C17/0654 ,  H01C17/06526

Abstract: PALLADIUM OXIDE OR OTHER METAL OXIDE REISTORS FOR MICROELECTRONIC CIRCUITRY ARE PROVIDED WITH A HIGH DEGREE OF REPRODUCIBILITY AND STABILITY BY FIRST CONCENTRATING TO POWDER FORM A LIQUID MIXTURE OF A RESISTOR METAL-ORGANO METALLIC COMPOUND, AT LEAST ONE OTHER STABLILIZER METAL IN ORGANOMETALLIC FORM, AND AN ANTI-AGGLOMERATING AGENT WHICH WILL NOT BURN OFF DURING PROCESSING TO FINAL RESISTOR FORM. THE POWDER IS THEN ALLOYED AND THE RESISTOR METAL OXIDIZED. THE RESULTING ALLOY IS THEN FORMED INTO A RESISTOR PASTE BY ADMIXING IT WITH A GLASS BINDER (EITHER BEFORE OR AFTER OXIDATION) AND A LIQUID CARRIER VEHICLE. THE PASTE IS PRINTED IN THE DESIRED PATTERN, DRIED AND FIRED TO PRODUCE THE RESISTOR IN FINAL FORM.

公开(公告)号：US3598761A

公开(公告)日：1971-08-10

申请号：US3598761D

申请日：1969-10-06

Applicant: OWENS ILLINOIS INC

Inventor： WOULBROUN JOHN M ,  MASON DANIEL W

IPC: H01B1/16 ,  H05K1/09 ,  H01B1/02 ,  B44D1/02

CPC classification number: H01B1/16 ,  H05K1/092

Abstract: A CLASS OF CONDUCTIVE COMPOSITIONS FOR INTERCONNECTING PARTS IN THICK FILM CIRCUITS IS DISCLOSED WHEREIN CONDUCTOR PATHS ARE FORMED BETWEEN PARTICLES OF MICRON SIZE WHICH ARE COATED WITH NOBLE METAL OVER A CORE WITH CONTRASTING PROPERTIES WHEREBY AFTER FIRING, A SOLDERABLE ADHERENT CONDUCTIVE BODY IS FORMED WHICH HAS THE DESIRABLE PROPERTIES OF PRIOR-ART CONDUCTORS OF THE PALLADIUM-GOLD TYPE, BUT WHICH CONTAIN A SUBSTANTIALLY LESSER NOBLE METAL CONTENT. "MOCK-METAL" PARTICLES SUCH AS PALLADIUM OVER ALUMINA AND GOLD OVER COPPER ARE DESCRIBED.

公开(公告)号：US3707499A

公开(公告)日：1972-12-26

申请号：US3707499D

申请日：1970-06-05

Applicant: DIANNE L NESTER ,  OWENS ILLINOIS INC

Inventor： MASON DANIEL W ,  NESTER HENRY H

IPC: C03C3/072 ,  C03C4/16 ,  C03C8/12 ,  C03C8/14 ,  C04B35/48 ,  H01B3/08 ,  H01G4/12 ,  H05K1/03 ,  H05K3/46 ,  C04B35/00 ,  H01B1/06 ,  H01B3/02

CPC classification number: C03C8/14 ,  C03C3/072 ,  C03C4/16 ,  C03C8/12 ,  C04B35/481 ,  H01B3/087 ,  H01G4/129 ,  H05K1/0306 ,  H05K3/4685 ,  Y10T428/24909 ,  Y10T428/256

Abstract: A DIELECTRIC MATERIAL IS FORMULATED BY FIRING AN ADMIXTURE OF FROM ABOUT 2-55% BY WEIGHT ZIRCON (ZIRCONIUM SILICATE) AND ABOUT 45-98% BY WEIGHT OF A LEAD BARIUM BOROSILICATE GLASS. IN FINAL FORM, THE DIELECTRIC MATERIAL EXHIBITS A LOW K (APPROXIMATELY 6) AND A HIGH Q VALUE. THE PASTE COMPOSITION IS FORMULATED BY ADMIXING THE AFOREMENTIONED INGREDIENTS IN AN ORGANIC VEHICLE, DRYING THE PASTE AND FIRING THE PASTE AT A TEMPERATURE OF FROM ABOUT 800-1,000*C. THE PASTE IS USUALLY APPLIED BY A SCREEN PRINTING TECHNIQUE PREFERABLY USING A MESH SIZE IN THE RANGE OF ABOUT 165.

公开(公告)号：US3679440A

公开(公告)日：1972-07-25

申请号：US3679440D

申请日：1971-01-18

Applicant: OWENS ILLINOIS INC

Inventor： MASON DANIEL W

IPC: C03C3/074 ,  C03C8/10 ,  C03C8/12 ,  C03C8/14 ,  C03C8/20 ,  H01B3/08 ,  H01G4/12 ,  C04B35/00 ,  C03C3/10 ,  H01B3/02

CPC classification number: H01G4/129 ,  C03C3/074 ,  C03C8/10 ,  C03C8/12 ,  C03C8/14 ,  C03C8/20 ,  H01B3/085 ,  H01G4/1245

Abstract: UNIQUE DIELECTRIC COMPOSITIONS MAY BE USED TO FORMULATE THICK FILM PASTES FOR PRINTING MICROELECTRONIC CAPACITORS. THE RESULTING DIELECTRICS EXHIBIT DIELECTRIC CONSTANTS GREATER THAN ABOUT 500 AND CAPACITANCES GREATER THAN ABOUT 80,000 PICOFARADS PER SQUARE INCH AT A THICKNESS OF AT LEAST ABOUT 1.0 MIL. THE UNIQUE DIELECTRIC COMPOSITIONS COMPRISE ABOUT 55-76 PERCENT BY WEIGHT OF A FERROELECTRIC MATERIAL AND 45-24 PERCENT OF A GLASS BINDER. THE GLASS BINDER EMPLOYED COMPRISES A LEAD BARIUM BOROSILICATE GLASS AND A FERROELECTRIC MATERIAL PREVIOUSLY DISSOLVED THEREIN. THE COMPOSITION IS FORMULATED INTO A PRINTING PASTE BY FIRST DISSOLVING 20-30 PERCENT BY WEIGHT FERROELECTRIC INTO 70-80 PERCENT BY WEIGHT LEAD BARIUM BOROSILICATE GLASS BINDER, COOLING THE NEWLY FORMED GLASS TO A SOLID STATE COMMINUTING THE GLASS TO A PARTICLE SIZE OF LESS THAN ABOUT 1 MICRON AND THEREAFTER ADMIXING THE COMMINUTED GLASS WITH THE SAME PARTICULATE FERROELECTRIC IN AN AMOUNT AS INDICATED. THIS ADMIXTURE IS THEN ADDED TO A LIQUID ORGANIC CARRIER VEHICLE TO FORMULATE THE PRINTING PASTE. THE PRINTING PASTE IS THEN PRINTED INTO A CHOSEN DESIGN AND FIRED AT A TEMPERATURE OF APPROXIMATELY 1,0001,050*C. TO PRODUCE A HIGHLY DENSE, UNIFORM, AND SUBSTANTIALLY CRACK-FREE DIELECTRIC MATERIAL.

Abstract translation: 可以使用独特的介电组合物来配制用于印刷微电子电容器的厚膜浆料。 所得到的电介质的厚度至少约为1.0密耳，其介电常数大于约500，电容大于约80,000皮​​法/平方英寸。 独特的介电组合物包含约55-76重量％的铁电材料和45-24重量％的玻璃粘合剂。 所使用的玻璃粘合剂包括铅钡硼硅酸盐玻璃和预先溶解在其中的铁电体材料。 通过首先将20-30重量％的铁电体溶解在70-80重量％的硼酸钡钡玻璃粘合剂中，将组合物配制成印刷浆料，将新形成的玻璃冷却至固态，将玻璃粉碎成粒度较小 约1微米，然后将粉碎的玻璃与相同的微粒铁电体混合，其量为所指示的量。 然后将该混合物加入到液体有机载体载体中以制备印刷浆料。 然后将印刷浆料印刷成选定的设计，并在约1000℃-150℃的温度下烧制，以产生高密度，均匀且基本上无裂纹的介电材料。