公开(公告)号：US3762901A

公开(公告)日：1973-10-02

申请号：US3762901D

申请日：1971-09-15

Applicant: OWENS ILLINOIS INC

Inventor： NOFZIGER N ,  SALISBURY C ,  SCHEPMAN J

IPC: H01J17/49 ,  C03C27/02

CPC classification number: H01J11/00

Abstract: There is disclosed the preparation of an electronic device comprising a gas discharge panel constructed out of two or more glass substrates, each substrate containing at least one array of electrodes. In one preferred embodiment, there is prepared a display/memory panel comprising a dielectric coating or layer applied over an array of electrodes. The panel preparation comprises firing and curing the electrode (with or without a dielectric coating) onto a glass substrate which is supported by a base plate which maintains its surface flatness and lubricity at the elevated firing and curing temperatures such that the relative flatness and smoothness of the glass substrate (and any dielectric coating fired thereon) are enhanced and the uniformity of the panel spacing is improved. The base plate is typically prepared from a refractory or ceramic-like material.

公开(公告)号：US3778242A

公开(公告)日：1973-12-11

申请号：US10288670

申请日：1970-12-30

Applicant: OWENS ILLINOIS INC

Inventor： FRANCEL J ,  MINNEMAN L ,  NOFZIGER N

IPC: C03C8/24 ,  C03C10/00 ,  C03C27/00 ,  C04B37/00 ,  C03C3/12 ,  C03C3/30

CPC classification number: C04B37/025 ,  C03C8/245 ,  C03C10/00 ,  C03C10/0027 ,  C03C10/0054 ,  C03C27/00 ,  C04B35/18 ,  C04B37/005 ,  C04B2237/10 ,  C04B2237/343 ,  C04B2237/40 ,  C04B2237/592

Abstract: Provided are sealing glass compositions particularly useful for sealing together alumina ceramic components in microelectronic circuitry. The sealing glass compositions are crystallizable and comprise a devitrifiable solder glass admixed with (1) a refractory material and (2) a pre-crystallized glass which together are employed in an amount sufficient to substantially reduce the time necessary to effect in situ crystallization and at the same time form a strong hermetic seal. The sealing glass compositions may be employed in any conventional form and are fired at about 400*-500* C. for about one minute to less than about 60 minutes to form a seal as described.

Abstract translation: 提供特别适用于将微电子电路中的氧化铝陶瓷部件密封在一起的密封玻璃组合物。 密封玻璃组合物是可结晶的，并且包括与（1）耐火材料混合的失透焊剂玻璃和（2）预结晶玻璃，其一起使用的量足以基本上减少实现原位结晶所需的时间 同时形成强烈的气密封。 密封玻璃组合物可以以任何常规形式使用，并在约400-500℃下烧制约1分钟至少于约60分钟以形成所述的密封。