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公开(公告)号：US20180290450A1
公开(公告)日：2018-10-11
申请号：US15766139
申请日：2016-10-07
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2002/14241 , B41J2002/1437 , B41J2002/14419 , H01L41/08
摘要： A process of manufacturing droplet jetting devices includes bonding together a nozzle wafer defining nozzles of the jetting devices, a membrane wafer carrying, on a membrane, actuators for generating pressure waves in a liquid in pressure chambers that are connected to the nozzles, and a distribution wafer forming a distribution layer that defines supply lines for supplying the liquid to the pressure chambers from a liquid reservoir formed on a side of the distribution layer opposite to the membrane wafer; and dicing the bonded wafers. The distribution layer has a thickness larger than the thickness of each of the other two wafers. A restrictor for controlling the inertance of the liquid supply line is formed through the distribution layer in a direction normal to the plane of that layer.
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公开(公告)号：US10093097B2
公开(公告)日：2018-10-09
申请号：US15431484
申请日：2017-02-13
摘要： A print head includes a plurality of chip-like tiles arranged on a common substrate, each tile having a front face with an array of recording elements disposed in the front face in a predetermined pattern, and a generally rectangular contour with a cut-out formed at at least one of its four corners, each cut-out being delimited by two reference-defining walls extending normal to one another and to the front face and serving as a reference for positioning the tiles on the substrate so as to establish a predetermined positional relationship between the recording elements of the different tiles. The substrate has a plurality of recesses accommodating each at least a part of a tile and having side walls that define engagement surfaces for each of the reference-defining walls of each tile, the substrate is formed of a material that is suitable for photo-lithographic processing, and the engagement surfaces of the substrate are surfaces formed by photo-lithographic techniques.
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公开(公告)号：US10391768B2
公开(公告)日：2019-08-27
申请号：US15766139
申请日：2016-10-07
摘要： A process of manufacturing droplet jetting devices includes bonding together a nozzle wafer defining nozzles of the jetting devices, a membrane wafer carrying, on a membrane, actuators for generating pressure waves in a liquid in pressure chambers that are connected to the nozzles, and a distribution wafer forming a distribution layer that defines supply lines for supplying the liquid to the pressure chambers from a liquid reservoir formed on a side of the distribution layer opposite to the membrane wafer; and dicing the bonded wafers. The distribution layer has a thickness larger than the thickness of each of the other two wafers. A restrictor for controlling the inertance of the liquid supply line is formed through the distribution layer in a direction normal to the plane of that layer.
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