公开(公告)号：US20170027056A1

公开(公告)日：2017-01-26

申请号：US14919442

申请日：2015-10-21

Applicant: Okins Electronics Co., Ltd.

Inventor： Jin Kook Jun ,  Sung Gye Park ,  Jae Weon Shim ,  Sang Hoon Cha

IPC: H05K1/11 ,  H05K1/02 ,  G01R1/04

CPC classification number: H05K1/11 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/07342 ,  G01R1/0735 ,  H05K1/028 ,  H05K2201/0364

Abstract: A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.

Abstract translation: 用于测试插座的微电子机械系统（MEMS）膜布置在半导体器件和用于执行半导体器件的电测试的测试装置之间，并且在裸膜上包括柔性裸片和多个圆形MEMS凸块， 每个MEMS凸块通过使用MEMS处理技术形成在裸膜上，该MEMS处理技术与测试装置的电极焊盘或半导体器件的导电球电接触，并且具有从边缘侧朝向 在朝向电极焊盘或导电球的方向上呈凸形的中心侧。