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公开(公告)号：US20180332704A1
公开(公告)日：2018-11-15
申请号：US16027288
申请日：2018-07-04
Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.
Inventor： Yung-Tai SU , Ching-Fang Cheng , Ti-Chiang Chiu
CPC classification number: H05K1/111 , H05K1/09 , H05K1/115 , H05K3/225 , H05K3/301 , H05K3/3436 , H05K3/4007 , H05K3/4038 , H05K2201/0364 , H05K2201/10734 , H05K2203/167
Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
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公开(公告)号：US10021783B2
公开(公告)日：2018-07-10
申请号：US15435320
申请日：2017-02-17
Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.
Inventor： Yung-Tai Su , Ching-Fang Cheng , Ti-Chiang Chiu
CPC classification number: H05K1/111 , H05K1/09 , H05K1/115 , H05K3/225 , H05K3/301 , H05K3/3436 , H05K3/4007 , H05K3/4038 , H05K2201/0364 , H05K2201/10734 , H05K2203/167
Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.
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公开(公告)号：US20170164483A1
公开(公告)日：2017-06-08
申请号：US15325470
申请日：2015-07-14
Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Inventor： Masahiko KOUCHI
CPC classification number: H05K1/189 , H01F27/2804 , H01F38/14 , H01F2017/006 , H01Q1/38 , H05K1/028 , H05K1/0296 , H05K2201/0364 , H05K2201/05 , H05K2201/055 , H05K2201/086 , H05K2201/10098
Abstract: A flexible printed circuit board according to an embodiment of the present invention includes at least one insulating layer having flexibility and containing a synthetic resin as a main component; and at least one conducting layer including a circuit pattern, wherein the circuit pattern includes a continuous spiral pattern, and the flexible printed circuit board includes a curved portion that curves such that one side and another side of the spiral pattern are disposed close to each other.
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公开(公告)号：US09566790B2
公开(公告)日：2017-02-14
申请号：US14627393
申请日：2015-02-20
Applicant: Seiko Epson Corporation
Inventor： Yoshihiko Yokoyama
CPC classification number: B41J2/1629 , B41J2/14233 , B41J2/1433 , B41J2/1607 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1643 , B41J2002/14491 , H05K3/06 , H05K3/061 , H05K3/062 , H05K3/064 , H05K3/383 , H05K3/384 , H05K3/467 , H05K2201/0364 , Y10T29/49401
Abstract: A method of forming a stacked wiring includes forming a first adhesion layer on a substrate, forming a first wiring on the first adhesion layer, etching the first adhesion layer and the first wiring by the same first wet etching so that the first wiring is in a reverse trapezoid shape in which a first width of a top surface is larger than a second width of a bottom surface contacting the first adhesion layer as a cross-section in a direction intersecting with a first wiring extending direction, covering the top surface and a side surface of the first wiring with a second adhesion layer, forming a second wiring on the second adhesion layer, and etching the second adhesion layer and the second wiring by the same second wet etching so that the second adhesion layer and the second wiring remain on only the top surface of the first wiring.
Abstract translation: 形成层叠布线的方法包括在基板上形成第一粘附层，在第一粘合层上形成第一布线，通过相同的第一湿蚀刻蚀刻第一粘合层和第一布线，使得第一布线处于 反向梯形，其中顶表面的第一宽度大于与第一粘合层接触的底面的第二宽度作为与第一布线延伸方向相交的方向的横截面，覆盖顶表面和侧面 所述第一布线的表面具有第二粘附层，在所述第二粘合层上形成第二布线，并且通过相同的第二湿蚀刻蚀刻所述第二粘合层和所述第二布线，使得所述第二粘合层和所述第二布线仅保留 第一个接线的顶面。
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5.发明公开公开(公告)号：US20240063110A1
公开(公告)日：2024-02-22
申请号：US18492816
申请日：2023-10-24
Applicant: CHUN-MING LIN
Inventor： CHUN-MING LIN
CPC classification number: H01L23/49866 , H01L23/49822 , C25D7/12 , H01L21/4857 , C25D3/38 , H01L23/49827 , H05K1/112 , H05K1/09 , H05K1/115 , H05K2201/0364 , H05K2201/095 , H05K2201/09509 , H05K1/18
Abstract: The present disclosure provides a method for forming a multilayer wiring structure, which includes: forming a patterned copper-phosphorous alloy layer over a carrier by performing a plating operation, and forming a dielectric layer over the patterned copper-phosphorous alloy layer. The forming the patterned copper-phosphorous alloy layer includes providing a plating solution having a copper source and a phosphorous source.
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Patent Agency Ranking
公开(公告)号：US09987827B2
公开(公告)日：2018-06-05
申请号：US14967349
申请日：2015-12-13
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： Yuan-Hao Jin , Qun-Qing Li , Shou-Shan Fan
IPC: G06F3/044 , C03C17/09 , B32B15/08 , C23C14/20 , C23C14/58 , C23C16/06 , C23C16/56 , C23C30/00 , C23F4/00 , G06F3/047 , H05K1/02 , H05K1/03 , H05K1/09 , B32B5/02 , H01B1/02 , H01B1/16
CPC classification number: B32B15/08 , B32B5/028 , B32B2307/202 , C03C17/09 , C03C2217/252 , C03C2217/253 , C03C2217/255 , C03C2218/15 , C03C2218/33 , C03C2218/34 , C23C14/20 , C23C14/5826 , C23C14/5873 , C23C16/06 , C23C16/56 , C23C30/00 , C23F4/00 , G06F3/044 , G06F3/047 , G06F2203/04103 , G06F2203/04112 , H01B1/026 , H01B1/16 , H05K1/0274 , H05K1/028 , H05K1/03 , H05K1/09 , H05K2201/026 , H05K2201/0323 , H05K2201/0364 , H05K2201/09681
Abstract: The disclosure relates to a touch panel. The touch panel includes a substrate having a surface, a transparent conductive layer, at least one electrode, and a conductive trace. The transparent conductive layer includes a metal nanowire film. The metal nanowire film includes a number of first metal nanowire bundles parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.
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公开(公告)号：US09713254B2
公开(公告)日：2017-07-18
申请号：US14873567
申请日：2015-10-02
Applicant: TPK HOLDING CO., LTD.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
IPC: H01L33/00 , H01L31/00 , H01B1/06 , H01M4/02 , H05K1/09 , H01L31/048 , H01L31/055 , H01L31/0216 , H05K1/02 , H05K1/11 , H05K1/03 , H01L31/05
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
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公开(公告)号：US20170171972A1
公开(公告)日：2017-06-15
申请号：US15444203
申请日：2017-02-27
Applicant: FUJIFILM Corporation
Inventor： Kensuke KATAGIRI , Shin TAJIRI , Akihiko HASE
CPC classification number: H05K1/09 , G06F3/041 , G06F3/044 , G06F3/045 , G09F9/00 , H01B1/02 , H01L51/0021 , H01L51/5212 , H05K1/0296 , H05K3/027 , H05K3/10 , H05K2201/0364 , H05K2201/09209 , H05K2203/0502 , Y10T29/49155
Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.
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9.发明申请DEVICE COMPONENTS WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS 有权具有表面嵌入式添加剂的器件组件及相关制造方法公开(公告)号：US20160029482A1
公开(公告)日：2016-01-28
申请号：US14873567
申请日：2015-10-02
Applicant: INNOVA DYNAMICS, INC.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。
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10.发明授权Device components with surface-embedded additives and related manufacturing methods 有权具有表面嵌入添加剂的器件组件及相关制造方法公开(公告)号：US09185798B2
公开(公告)日：2015-11-10
申请号：US14299938
申请日：2014-06-09
Applicant: INNOVA DYNAMICS, INC.
Inventor： Michael Eugene Young , Arjun Daniel Srinivas , Matthew R. Robinson , Alexander Chow Mittal
IPC: H01L31/00 , H01L31/048 , H01L31/0216 , H05K1/02 , H01L31/055 , H05K1/09 , H05K1/11
CPC classification number: H05K1/09 , H01L31/02167 , H01L31/0481 , H01L31/05 , H01L31/055 , H05K1/0274 , H05K1/0313 , H05K1/115 , H05K2201/0302 , H05K2201/0326 , H05K2201/0364 , H05K2201/10977 , Y02E10/52 , Y02E10/54 , Y02E10/542
Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.
Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。
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