Etchant and process of etching with the same
    1.
    发明授权
    Etchant and process of etching with the same 失效
    蚀刻和蚀刻过程相同

    公开(公告)号:US4130454A

    公开(公告)日:1978-12-19

    申请号:US822002

    申请日:1977-09-30

    CPC分类号: C23F1/16 C23F1/18

    摘要: This invention is directed to an etchant and to a process for its use. The etchant comprises a synergistic combination of hydrogen peroxide and molybdenum as oxidants in acidic solution. The combination of oxidants provides for sustained etching at an exalted rate. The etchant is useful for etching metals, especially copper and its alloys, and is particularly useful in the manufacture of printed circuit boards.

    摘要翻译: 本发明涉及一种蚀刻剂及其使用方法。 蚀刻剂包括作为氧化剂在酸性溶液中的过氧化氢和钼的协同组合。 氧化剂的组合提供以高达率的持续蚀刻。 蚀刻剂对于蚀刻金属,特别是铜及其合金是有用的,并且在印刷电路板的制造中特别有用。

    Etchant and process
    2.
    发明授权
    Etchant and process 失效
    蚀刻和过程

    公开(公告)号:US4144119A

    公开(公告)日:1979-03-13

    申请号:US822003

    申请日:1977-09-30

    IPC分类号: C23F1/02 C23F1/18 H05K3/06

    CPC分类号: C23F1/02 C23F1/18 H05K3/067

    摘要: This invention is directed to an etchant and to a process for its use. The etchant comprises sulfuric acid activated with hydrogen peroxide or the synergistic combination of hydrogen peroxide and molybdenum. The etchant is characterized by a source of phosphate ions as an inhibitor against attack on tin, especially immersion tin, as well as several other metals such as nickel and alloys of nickel such as gold alloys. The etchant is especially useful for etching copper and its alloys in the presence of a tin etch resist, and therefore, provides a new procedure for the fabrication of printed circuit boards using immersion tin as an etch resist.

    摘要翻译: 本发明涉及一种蚀刻剂及其使用方法。 蚀刻剂包括用过氧化氢活化的硫酸或过氧化氢和钼的协同组合。 蚀刻剂的特征在于磷酸根离子作为防止对锡的侵蚀的抑制剂,特别是浸锡,以及若干其它金属如镍和镍合金如金合金。 蚀刻剂对于在锡蚀刻抗蚀剂存在下蚀刻铜及其合金特别有用,因此提供了使用浸锡作为抗蚀剂制造印刷电路板的新方法。

    Metal plating solution
    3.
    发明授权
    Metal plating solution 失效
    金属电镀液

    公开(公告)号:US3977884A

    公开(公告)日:1976-08-31

    申请号:US538125

    申请日:1975-01-02

    摘要: An electroless metal plating solution is characterized by an elemental sulfur stabilizer, either in colloidal or soluble, non-ionic form. Elemental sulfur as a stabilizer is an improvement over prior art stabilizers as it can be used in substantially larger concentration than prior art divalent sulfur stabilizers which are catalytic poisons.

    摘要翻译: 无电金属电镀溶液的特征在于以胶态或可溶性非离子形式的元素硫稳定剂。 作为稳定剂的元素硫是比现有技术的稳定剂更好的改进,因为它可以比现有技术的二价硫稳定剂(其是催化毒物)大得多的浓度使用。