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公开(公告)号：US4482596A
公开(公告)日：1984-11-13
申请号：US411346
申请日：1982-08-25
申请人： Michael Gulla , Oleh B. Dutkewych
发明人： Michael Gulla , Oleh B. Dutkewych
IPC分类号： C22C9/00 , C23C18/36 , C23C18/40 , C23C18/48 , H05K3/18 , H05K3/24 , H05K3/46 , B32B3/10 , B32B15/04
CPC分类号： H05K3/181 , C23C18/48 , Y10S428/901 , Y10T428/24273 , Y10T428/31507 , Y10T428/31529 , Y10T428/31533 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31703 , Y10T428/31707
摘要： A structure having a catalytic surface plated with an autocatalytic electroless alloy of copper, a metal selected from nickel, cobalt, mixtures thereof and phosphorous.
摘要翻译： 具有镀有铜的自催化无电解合金的催化表面的结构，选自镍，钴，其混合物和磷的金属。
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公开(公告)号：US4695505A
公开(公告)日：1987-09-22
申请号：US791597
申请日：1985-10-25
申请人： Oleh B. Dutkewych
发明人： Oleh B. Dutkewych
CPC分类号： C23C18/40 , H05K1/09 , H05K2203/072 , Y10T428/24917
摘要： An electroless copper deposit having an elongation capability of at least 10 percent as determined by a mechanical bulge test on a foil having a thickness of between 1.5 and 2.0 mils.
摘要翻译： 通过在厚度为1.5至2.0密耳之间的箔上的机械凸起试验测定的具有至少10％的伸长能力的无电镀铜沉积物。
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公开(公告)号：US4634468A
公开(公告)日：1987-01-06
申请号：US607649
申请日：1984-05-07
申请人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
发明人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
CPC分类号： C23C18/30
摘要： A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.
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公开(公告)号：US4725314A
公开(公告)日：1988-02-16
申请号：US908277
申请日：1986-09-17
申请人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
发明人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
CPC分类号： C23C18/30
摘要： A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.
摘要翻译： 一种悬浮在水溶液中的催化吸附物，其包含在有机悬浮剂上的还原催化金属，其中还原催化金属的最大尺寸不超过500埃。 催化吸附物对于无电金属沉积的非金属沉积基材是非常有用的。
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公开(公告)号：US4652311A
公开(公告)日：1987-03-24
申请号：US691880
申请日：1985-01-16
申请人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
发明人： Michael Gulla , Oleh B. Dutkewych , John J. Bladon
摘要： A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms and the organic suspending agent is one capable of complexing with ions of the catalytic metal. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.
摘要翻译： 悬浮在水溶液中的催化吸附物，其包含在有机悬浮剂上的还原催化金属，其中还原的催化金属的最大尺寸不超过500埃，有机悬浮剂是能够与催化金属的离子络合的。 催化吸附物对于无电金属沉积的非金属沉积基材是非常有用的。
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公开(公告)号：US4144119A
公开(公告)日：1979-03-13
申请号：US822003
申请日：1977-09-30
摘要： This invention is directed to an etchant and to a process for its use. The etchant comprises sulfuric acid activated with hydrogen peroxide or the synergistic combination of hydrogen peroxide and molybdenum. The etchant is characterized by a source of phosphate ions as an inhibitor against attack on tin, especially immersion tin, as well as several other metals such as nickel and alloys of nickel such as gold alloys. The etchant is especially useful for etching copper and its alloys in the presence of a tin etch resist, and therefore, provides a new procedure for the fabrication of printed circuit boards using immersion tin as an etch resist.
摘要翻译： 本发明涉及一种蚀刻剂及其使用方法。 蚀刻剂包括用过氧化氢活化的硫酸或过氧化氢和钼的协同组合。 蚀刻剂的特征在于磷酸根离子作为防止对锡的侵蚀的抑制剂，特别是浸锡，以及若干其它金属如镍和镍合金如金合金。 蚀刻剂对于在锡蚀刻抗蚀剂存在下蚀刻铜及其合金特别有用，因此提供了使用浸锡作为抗蚀剂制造印刷电路板的新方法。
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公开(公告)号：US06824665B2
公开(公告)日：2004-11-30
申请号：US09978797
申请日：2001-10-17
IPC分类号： C23C2802
CPC分类号： H01L21/76868 , C23C18/1671 , C23C18/38 , C23C18/405 , H01L21/288 , H01L21/2885 , H01L21/76843 , H01L21/76874 , H01L2221/1089 , H05K3/181 , H05K3/388 , H05K3/422 , Y10S205/916
摘要： Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
摘要翻译： 公开了在具有导电层的基板上沉积铜籽晶层的方法。 这种方法特别适用于在具有小孔径的基底上沉积铜籽晶层，并且优选地非常小的孔。
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公开(公告)号：US4130454A
公开(公告)日：1978-12-19
申请号：US822002
申请日：1977-09-30
摘要： This invention is directed to an etchant and to a process for its use. The etchant comprises a synergistic combination of hydrogen peroxide and molybdenum as oxidants in acidic solution. The combination of oxidants provides for sustained etching at an exalted rate. The etchant is useful for etching metals, especially copper and its alloys, and is particularly useful in the manufacture of printed circuit boards.
摘要翻译： 本发明涉及一种蚀刻剂及其使用方法。 蚀刻剂包括作为氧化剂在酸性溶液中的过氧化氢和钼的协同组合。 氧化剂的组合提供以高达率的持续蚀刻。 蚀刻剂对于蚀刻金属，特别是铜及其合金是有用的，并且在印刷电路板的制造中特别有用。
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