公开(公告)号：US20220165670A1

公开(公告)日：2022-05-26

申请号：US17103633

申请日：2020-11-24

Applicant: OmniVision Technologies, Inc.

Inventor： Yin QIAN ,  Ming ZHANG ,  Dyson H. TAI ,  Lindsay GRANT

IPC: H01L23/532 ,  H01L23/00 ,  H01L23/522 ,  H01L25/065 ,  H01L21/768

Abstract: A semiconductor device that includes a metal pad buried in the semiconductor substrate that is electrically connected to a metal interconnection structure and electrically isolated from the semiconductor substrate. The semiconductor substrate forms an opening that extends from a back surface to the metal pad. A method for manufacturing a semiconductor device with buried metal pad including depositing, in a recess of a semiconductor substrate, a metal pad, isolating the pad from the substrate, electrically connecting the metal pad to the frontside of the substrate and connecting the metal pad to the backside of the substrate with an opening. A method for stabilizing through-silicon via connections in semiconductor device including electrically coupling a metal interconnection structure to a metal pad submerged in a semiconductor substrate and forming a through-silicon via into the semiconductor substrate that contacts the metal pad.

公开(公告)号：US20200279880A1

公开(公告)日：2020-09-03

申请号：US16290832

申请日：2019-03-01

Applicant: OmniVision Technologies, Inc.

Inventor： Ming ZHANG ,  Yin QIAN ,  Chia-Chun MIAO ,  Dyson H. TAI

IPC: H01L27/146

Abstract: A flip-chip sample imaging device with self-aligning lid includes an image sensor chip, a fan-out substrate, and a lid. The image sensor chip includes (a) a pixel array sensitive to light incident on a first side of the image sensor chip and (b) first electrical contacts disposed on the first side and electrically connected to the pixel array. The fan-out substrate is disposed on the first side, is electrically connected to the first electrical contacts, forms an aperture over the pixel array to partly define a sample chamber over the pixel array, and forms a first surface facing away from the first side. The lid is disposed on the first surface of the fan-out substrate, facing away from the first side, to further define the chamber. The lid includes an inner portion protruding into the aperture to align the lid relative to the fan-out substrate.

公开(公告)号：US20190305027A1

公开(公告)日：2019-10-03

申请号：US15937742

申请日：2018-03-27

Applicant: OmniVision Technologies, Inc.

Inventor： Yin QIAN ,  Chia-Chun MIAO ,  Ming ZHANG ,  Dyson H. TAI

IPC: H01L27/146 ,  H01L23/00 ,  H01L21/768 ,  H01L23/48 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  H01L21/288 ,  H01L21/3213

Abstract: Packaged photosensor ICs are made by fabricating an integrated circuit (IC) with multiple bondpads; forming vias from IC backside through semiconductor to expose a first layer metal; depositing conductive metal plugs in the vias; depositing interconnect metal; depositing solder-mask dielectric over the interconnect metal and openings therethrough; forming solder bumps on interconnect metal at the openings in the solder-mask dielectric; and bonding the solder bumps to conductors of a package. The photosensor IC has a substrate; multiple metal layers separated by dielectric layers formed on a first surface of the substrate into which transistors are formed; multiple bondpad structures formed of at least a first metal layer of the metal layers; vias with metal plugs formed through a dielectric over a second surface of the semiconductor substrate, interconnect metal on the dielectric forming connection shapes, and shapes of the interconnect layer coupled to each conductive plug and to solder bumps.

公开(公告)号：US20210327948A1

公开(公告)日：2021-10-21

申请号：US16853684

申请日：2020-04-20

Applicant: OmniVision Technologies, Inc.

Inventor： Chia-Ying LIU ,  Wu-Zang YANG ,  Chia-Jung LIU ,  Ming ZHANG ,  Yin QIAN ,  Alireza BONAKDAR

IPC: H01L27/146 ,  H01L31/14 ,  H01L31/0352 ,  H01L31/0216

Abstract: An image sensor with embedded wells for accommodating light emitters includes a semiconductor substrate including an array of doped sensing regions respectively corresponding to an array of photosensitive pixels of the image sensor. The semiconductor substrate forms an array of wells. Each well is aligned with a respective doped sensing region to facilitate detection, by the photosensitive pixel that includes said respective doped sensing region, of light emitted to the photosensitive pixel by a light emitter disposed in the well. The image sensor further includes, between adjacent doped sensing regions, a light-blocking barrier to reduce propagation of light to the doped sensing-region of each photosensitive pixel from wells not aligned therewith.